Flexible circuit board etching liquid concentration control device

Abstract

The invention relates to a flexible circuit board etching liquid concentration control device belonging to the technical field of etching liquid detection and control devices and comprising a testing box with a box cavity, an etching pool, a liquid inlet pipe and a liquid return pipe. The testing box is provided with a controller as well as an oxidant probe, a hydrochloric acid probe and a hydrometer which are respectively and electrically connected with the controller and extend into the testing box; the etching pool is provided with an oxidant adding pipe, a hydrochloric acid inlet pipe and a water inlet pipe; the oxidant adding pipe, the hydrochloric acid inlet pipe and the water inlet pipe are respectively provided with a control valve; the control valves are electrically connected with the controller; one end of the liquid inlet pipe is connected with the etching pool, the middle is provided with a conveying pump and a valve, and the other end extends into the testing box; and one end of the liquid return pipe is connected with the etching pool and the other end is connected with the testing box. The invention has the characteristic that the oxidant probe is inserted into the pipe cavity of the liquid inlet pipe. The invention has the advantage of ensuring the etching effect of the etching pool to FPC boards.

Description

technical field [0001] The invention belongs to the technical field of etching liquid detection and control devices, and in particular relates to a flexible circuit board etching liquid concentration control device. Background technique [0002] During the processing of flexible printed circuit (FPC) boards, in order to use etching solution to etch the FPC to form a circuit structure, the oxidant in the etching solution, that is, copper chloride, has more or less components, which will cause unfavorable factors. For example, when the oxidant component is small That is, when the content is low, the etching speed becomes slow or even impossible to etch, while too much will cause unnecessary waste. Therefore, manufacturers of FPC boards usually provide an etching solution concentration control device in the etching pool (also known as a working pool), and the etching pool is connected to the test box of the etching solution concentration control device by a pipeline, and the et...

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Problems solved by technology

[0006] But there is following shortcoming in the structure of the flexible circuit board etching solution concentration control device in the prior art: since the oxidant probe installed on the tester penetrates into the etching solution in the test box, the concentration in the etching solution measured by it is The oxidant concentration is essentially the concentration of the oxidant in the etching solution in the test chamber, rather than the concentration of the oxidant in the etching solution when it is subsequently introduced from the etching pool into the test chamber, because there is already existing corrosion in the test chamber from the etching solution. The concentration of the oxidant in the etching solution from the etching pool is often different from the concentration of the oxidizing agent in the subsequent etching solution introduced from the etching pool, so the measured value of the oxidant probe has a delay. The so-called late phenomenon means that the oxidant probe cannot directly measure the concentration of oxidant in the subsequent etching solution that is being introduced into the test box from the etching pool, but can only enter the test box at different stages or at different times. There has been a concentration test of the oxidant in the mixed etching solution, which inevitably lacks pertinence and accuracy and affects the etching effect

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