Electric deposition nickel pottery plating solution and preparing method thereof

Abstract

The invention provides an electric deposition nickel pottery plating solution and a preparing method thereof. The method is characterized by using electric deposition nickel or nickel-base alloy plating solution as base plating solution, and adding insoluble inorganic nonmetallic micron-grade particles pretreated by non-ionic potyoxyethylene ether surfactant in the base plating solution, so that nickel pottery coating is deposited on a metal matrix. The invention employing non-ionic activator can effectively increase decentrality, stability, evenness and suspension degree of particles, promote codeposition for particles, reduce particle content in the plating solution, improve conductivity of the plating solution, and greatly increase organization performance of the nickel-base composite coating. The invention has advantages of simple process and easy execution.

Description

technical field [0001] The invention relates to an electroplating solution and a preparation method, in particular to a nickel-based or nickel-based alloy and insoluble micron-scale inorganic non-metallic particle composite ceramic plating solution and a preparation method thereof, belonging to the electroplating category in the field of metallurgical chemistry. Background technique [0002] Composite coatings have been used in the industrial field since the 1960s. According to their functions, composite coatings can be divided into wear-resistant composite coatings, self-lubricating composite coatings and other functional coatings. Composite plating has been widely used due to its advantages of low cost, simple process, uniform coating thickness, and large-area plating. [0003] Composite plating is to add inert solid particles with special properties to the plating solution to co-deposit them with the matrix metal to prepare a composite coating with special properties. Th...

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Problems solved by technology

[0007] In the research and implementation of composite plating, the dispersion of particles is one of the key issues. In the patent No. 91107925.4 and publication No. CN1072466, the invention patent "Cylinder Inner Wall Electroplating Nickel-Silicon Carbide Process", the silicon carbide content in the plating solution involved It is 50-300 g / L. During the simulation experiment, it was found that what really works is the silicon carbide that can be suspended in the bath. For this reason, it is necessary to fully stir the bath and increase the particle content in the bath. However, the increase of particle content will mean sacrificing the conductivity of the plating solution, and the effect is very unsatisfactory; and sufficient stirring cannot be implemented for some parts with narrow operating space, such as cylinders, which makes the particle content and distribution in the coating difficult. control

[0008] In order to improve the dispersibility of particles in the plating solution, the application number is 99113717.5, and the publication number is CN1240259. In the invention patent "aluminum alloy cylinder inner wall nickel-ceramic composite coating process", it is proposed to use positively or negatively charged ceramic powder particles, so that It can play a certain role in hindering the agglomeration of particles and enhancing the adsorption of particles and matrix metal. However, in the electroplating process, when the workpiece is used as the cathode, theoretically only the positively charged particles are deposited in the coating. Generally, cationic surfactants are used to coat the particles to make them positively charged, and the basic plating solution generally contains anionic surfactants that play a wetting role, such as sodium lauryl sulfate, etc. Therefore, for this technology In the actual production application, the compatibility of the cationic surfactant with the basic plating solution and how to compound the anion and cation are still unresolved.