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Glass fiber reinforced polyamide resin composition

A technology of polyamide resin and glass fiber, which is applied in the direction of electrical equipment casings/cabinets/drawers, electrical components, etc., can solve problems such as deterioration and hindering the surface appearance of metal molds, so as to ensure fluidity, excellent surface appearance, and reduce metal The effect of mold temperature

Inactive Publication Date: 2009-08-19
UNITIKA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in these methods, the burrs can be effectively suppressed by blocking the gaps (fine gaps between holes / cores) of the metal mold where burrs are generated by using an inorganic filler material. The problem that the material hinders the metal mold and the surface appearance deteriorates

Method used

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  • Glass fiber reinforced polyamide resin composition
  • Glass fiber reinforced polyamide resin composition
  • Glass fiber reinforced polyamide resin composition

Examples

Experimental program
Comparison scheme
Effect test

reference example 1

[0131] (Reference Example 1): Amorphous polyamide (A-5)

[0132]10 kg of raw materials with a ratio of 45 mol % of isophthalic acid, 5 mol % of terephthalic acid, 45 mol % of hexamethylenediamine, and 5 mol % of bis-(4-amino-3-methylcyclohexyl) methane It was charged into a reaction tank together with 8 kg of pure water, and the air in the reaction tank was degassed several times with nitrogen. After raising the temperature to 90°C and reacting for 5 hours, the reaction temperature was gradually raised to 280°C over 10 hours while stirring the tank under pressure (18 watts). Then, after the pressure was released to lower the pressure to atmospheric pressure, polymerization was further performed at the same temperature for 6 hours. After the reaction, it was taken out from the reaction tank and cut to obtain pellets. The relative viscosity of the obtained pellets (by the same method as above) was 1.90. The glass transition temperature is 150°C, and the crystal fusion heat is...

reference example 2

[0134] (Reference example 2): Amorphous polyamide (A-6)

[0135] 10kg of raw materials with a ratio of 70 mol% of isophthalic acid, 30 mol% of terephthalic acid, and 100 mol% of hexamethylenediamine and 8kg of pure water are put into the reaction tank, and the air in the reaction tank is purged with nitrogen. Degas several times. After raising the temperature to 90°C and reacting for 5 hours, the reaction temperature was gradually raised to 280°C over 10 hours while stirring the tank under pressure (18 watts). Then, after the pressure was released to lower the pressure to atmospheric pressure, polymerization was further performed at the same temperature for 6 hours. After the reaction was completed, it was taken out from the reaction tank and cut to obtain pellets. The relative viscosity of the obtained pellets (by the same method as above) was 2.1. The glass transition temperature is 125°C, and the crystal fusion heat is 0 cal / g.

[0136] 【0059】

[0137] (1) Raw material...

manufacture example

[0176] (A-7) Preparation of polyamide resin

[0177] Using TEM37BS manufactured by Toshiba Machine Co., Ltd., 40% by mass of polyamide 66 resin, 25% by mass of polyamide 12 resin, and 35% by mass of amorphous polyamide resin were mixed under the conditions of extrusion temperature 280°C, screw rotation speed 250rpm, and stirring torque 60%. quality%. The obtained polyamide resin (A-7) was dried and used for later tests.

[0178] 【0067】

[0179] (A-8) to (A-17) Preparation of polyamide resin

[0180] According to the compounding ratio described in Table 1, it prepared similarly to (A-7).

[0181]

[0182] 【0069】

[0183] (A-18) to (A-27) Polyamide resins were prepared in the same manner as (A-7) according to the compounding ratio described in Table 2.

[0184] 【0070】

[0185] 【Table 2】

[0186]

[0187] 【0071】

[0188] (A-28)~(A-35) Preparation of polyamide resin

[0189] According to the compounding ratio described in Table 3, it prepared similarly to (A-7).

...

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Abstract

The invention provides a glass fiber reinforced daiamid resin composition, which has excellent thin-wall forming property and surface appearance, and is applied to thin-wall portable electronic appliance components or computer frame components. The glass fiber reinforced daiamid resin composition is formed in combined with 50 to 150 parts of glass fiber by weight relative to 100 parts of daiamid resin composition by weight containing 90% to 99% of daiamid resin by weight and 1% to 10% of acid modified styrene elastomer by weight, the daiamid resin is combined with 20% to 60% of daiamid 66 resin by weight, 20% to 40% of daiamid 12 resin and 20% to 50% of amorphous daiamid resin by weight, and the total dose is 100% by weight.

Description

technical field [0001] 【0001】 [0002] The present invention relates to a glass fiber-reinforced polyamide resin composition and a molded product. More specifically, it relates to a glass fiber suitable for thin-walled portable electronic device parts or computer housing parts with excellent mechanical strength, thin-wall formability, and surface appearance. Reinforced polyamide resin composition and molded article. Background technique [0003] 【0002】 [0004] Conventionally, amorphous thermoplastic resins such as polycarbonate resins and ABS resins excellent in surface appearance and low warpage of molded products have been used for housings of portable electronic devices such as PDAs, mobile phones, and computers. Moreover, in the process of miniaturization and weight reduction of electronic equipment, the resin used for the frame body is also seeking thin-walled molded products. The aforementioned polycarbonate resin or ABS resin has been blended with talc or glass fib...

Claims

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Application Information

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IPC IPC(8): C08L77/00C08K7/14
CPCC08J5/04C08K7/14C08L25/08C08L77/02H05K5/00
Inventor 木皿嘉仁藤井茂太藤井弘片平新一郎
Owner UNITIKA LTD
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