Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electronic component, protection method and apparatus for circuit board

A technology for electronic components and electronic devices, which can be applied in the direction of sealing shell, cooling/ventilation/heating transformation, etc., can solve the problems of poor heat dissipation, short-circuit failure, and high temperature of components, and achieve weight reduction, high reliability, and improved insulation. Effect

Inactive Publication Date: 2009-08-12
梁威
View PDF0 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, since the air flows between the components, the tiny dust suspended in the air cannot avoid partly adhering to these electronic components. The long-term accumulation of these dusts will gradually thicken, causing poor heat dissipation of each component and further causing excessive temperature. If it is serious, it will cause a short-circuit fault; in addition, in order to ensure air circulation, this heat dissipation method must have an essential ventilation hole on its shell, and it will have the opportunity to be attacked by small insects in different environments. entry, causing a more serious malfunction

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic component, protection method and apparatus for circuit board
  • Electronic component, protection method and apparatus for circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Such as figure 1 As shown, the circuit board 5 or electronic components 4 of the protective device for electronic components and circuit boards of the present invention are fixed in a closed container 1, and the relevant leads of the electronic components and circuit board pass through the sealing member or connector 3 Connected to the outside of the container 1, the container is filled with an insulating liquid 6 that has no effect on the electronic device and is non-corrosive. The insulating liquid 6 is transformer oil, which cannot completely fill the container 1, and a certain space 7 is properly reserved to prevent the temperature from rising The expansion of the liquid will destroy the airtight container; the shell of the container 1 is provided with a cooling fin 2, so that the cooling effect is better. The circuit board can be fixed in the airtight container, or the circuit board can be integrated with the airtight container. For example, when making the airtigh...

Embodiment 2

[0021] Such as figure 2 As shown, another kind of implementation structure of the protective device of electronic components and circuit boards of the present invention is that electronic components and circuit boards and a smaller radiator 8 are packaged together in polybutene oil+transformer oil+grate The airtight container 1 of the mixed insulating liquid of sesame oil solves the problem of long-term installation of electronic components that require heat dissipation but are inconvenient to maintain. All the other structures are the same as in Example 1.

[0022] The protective device for electronic components and circuit boards of the present invention has been used in the computer case tested by the inventor for two years without regular cleaning of dust, and no electronic components and circuit boards have failed.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method and a device for cooling, dustproofing and waterproofing for electronic devices and components and a circuit board. The electronic devices and components and the circuit board are fixed in a sealed container; insulative non-corrosive liquid without influence on the electronic devices is filled in the container; and related lead wires of the electronic devices and components and the circuit board are connected outside the container through a sealing element or a connector. The method and the device solve the problem that the electronic components and the circuit board are polluted and influenced by dust, vapor or impurities, greatly improve the insulativity, and also greatly improve the reliability of the electronic components and the circuit board.

Description

technical field [0001] The invention relates to a protective device for electronic devices, in particular to a method and device for cooling electronic components and circuit boards, and for preventing dust and water. Background technique [0002] In the electronic circuit device, there are various components that emit heat during normal operation. The traditional way of dissipating this heat is to dissipate it by relying on natural flow or forced flow of air medium to ensure that the temperature is within a certain range. within the acceptable range. These components must also be kept insulated from each other to avoid short circuit failures. In this way, since the air flows between the components, the tiny dust suspended in the air cannot avoid partly adhering to these electronic components. The long-term accumulation of these dusts will gradually thicken, causing poor heat dissipation of each component and further causing excessive temperature. If it is serious, it will...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K5/06H05K7/20
Inventor 梁威
Owner 梁威
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com