High-thermoresistance forsterite light material and preparation thereof
A technology of forsterite and lightweight materials, which is applied in the field of composite refractory and thermal insulation materials, can solve the problems of high cost, performance impact, and low degree of industrialization, and achieve low cost, excellent performance, and the effect of reducing thermal pollution
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Embodiment 1
[0012] A light material of forsterite with high thermal resistance and a preparation method thereof. Firstly, 20-25wt% of sodium chloride powder and 75-80wt% of forsterite raw ore powder are mixed, and 3-7wt% of lignosulfur is added to the mixture Lignosulfonate and calcium lignosulfonate are first dissolved into an aqueous solution and then used as ingredients, stirred for 10-20 minutes, pressed into shape; then dried at 60-110°C for 12-24 hours, at 800-900°C × 5-6 Firing in air under the condition of 1 hour, soaking in water for 24-36 hours after natural cooling; then drying at 60-110°C for 12-24 hours, the high thermal resistance forsterite light material can be obtained.
Embodiment 2
[0014] A light-weight material of forsterite with high thermal resistance and a preparation method thereof, except that the binder is sodium lignosulfonate, the rest are the same as in Example 1.
Embodiment 3
[0016] A light material of forsterite with high thermal resistance and a preparation method thereof. Firstly, 25-30wt% of potassium chloride powder and 70-75wt% of forsterite raw ore powder are mixed, and 7-10wt% of industrial dextrin is added to the above-mentioned mixture The powder is used as a binder. The industrial dextrin powder is firstly dissolved into an aqueous solution and then used for batching, stirred for 15-25 minutes, pressed into shape, and then dried at 60-110°C for 24-36 hours, and then dried at 900-1000°C×4~ Firing in air for 5 hours, soaking in water for 36-48 hours after natural cooling, and then drying at 60-110°C for 24-36 hours, the high thermal resistance forsterite light material can be obtained.
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