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Dyadic transition group metallic oxide non-volatilization electric resistance transition type memory

A technology of transition metals and resistance transformation, applied in read-only memory, static memory, information storage, etc., can solve the problems of difficult manual control, unstable resistance transformation characteristics, low yield of memory devices, etc., and achieve distribution controllable and Uniformity, stable device resistance transition characteristics, and improved yield

Inactive Publication Date: 2010-06-16
SEMICON MFG INT (SHANGHAI) CORP +1
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Problems solved by technology

But one thing is certain, there is a strong relationship between the resistance transition characteristics and the defect states in binary transition metal oxide materials
[0013] Because the defect states formed by natural growth are difficult to control artificially, the yield of memory devices based on the resistance transition characteristics of binary transition metal oxide materials is not high, and the resistance transition characteristics are unstable.

Method used

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  • Dyadic transition group metallic oxide non-volatilization electric resistance transition type memory
  • Dyadic transition group metallic oxide non-volatilization electric resistance transition type memory
  • Dyadic transition group metallic oxide non-volatilization electric resistance transition type memory

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Embodiment Construction

[0038] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0039] Such as image 3 as shown, image 3 It is a schematic structural diagram of a binary transition metal oxide non-volatile resistance transition memory based on ion implantation provided by the present invention. The memory includes an upper conductive electrode 301, a lower conductive electrode 302, and a The binary transition group metal oxide film 303 between them is implanted with ions 304 .

[0040] The upper conductive electrode and the lower conductive electrode are made of metal or other conductive electrode materials.

[0041] The binary transition metal oxide film is made of binary oxides of transition metals such as zirconia, nickel oxide, titanium oxide, hafnium oxide, cobalt oxide, vanadium oxide, niob...

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Abstract

The invention discloses a binary transition metal oxide nonvolatile resistance-transition memory based on ion implantation. The memory comprises an upper conductive electrode; a lower conductive electrode; a binary transition metal oxide film arranged between the upper conductive electrode and the lower conductive electrode, wherein ions are implanted in the binary transition metal oxide film. Thebinary transition metal oxide film with ions implanted therein can greatly improve the yield of the memory, increase the ratio of high resistance state to low resistance state of the device and reduce the discrete value of the resistance transition characteristics among the devices. The memory device has the advantages of simple structure, easy integration, and low cost, and is compatible to theconventional silicon planar CMOS process, which facilitates the extensive generalization and application of the memory.

Description

technical field [0001] The invention relates to the technical field of microelectronic devices and memories, in particular to a binary transition metal oxide non-volatile resistance transition memory based on ion implantation. Background technique [0002] In recent years, the growth rate of memory in integrated circuits (IC) has surpassed that of logic circuits, and the proportion of memory in chip area has increased from 20% in 1999 to 71% in 2005. According to statistics in the fourth quarter of 2005, 47% of IC manufacturing capacity in the world is used for memory, while logic products only account for 29%. [0003] At present, my country's entire memory market accounts for nearly 40% of the semiconductor market, and is expected to reach 75.94 billion yuan in 2009. At the same time, affected by the explosive growth of the current 3C consumer electronics market, among various memory products, the fastest growing market demand is non-volatile memory (NVM). Flash memory (...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L45/00H01L27/24G11C16/02
Inventor 刘琦刘明龙世兵贾锐管伟华
Owner SEMICON MFG INT (SHANGHAI) CORP
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