Metal carrier band for packaging noncontact module with large size

Abstract

The invention provides a metal carrier band for packaging a noncontact module with large size which is characterized in that the metal carrier band comprises a chip bearing region which can bear a chip of 3.9*4.5mm. The chip which is 1.5 times of the area of a common chip can be bear and packaged, and a module product with the same mechanical size is obtained. By the improvement of the metal carrier band and under the premise of the increased size of the packaged chip, the combining force of a mould body with the metal carrier band is improved to the maximum extent after the mould packaging, therefore, the mechanical force resistance of internal devices is improved greatly. The carrier band is packaged in a reeling way. Under the premise of not adding the investment, the present conventional packaging process and the existing equipment can be used for producing products with better quality, therefore, the application of high-end chips, such as noncontact intelligent electronic passport, EMV band card, and the like in the intelligent card field is expanded.

Description

technical field [0001] The invention relates to the technical field of microelectronic semiconductor packaging, in particular to the technical field of non-contact smart card module packaging. In particular, it is a metal carrier tape for large-size non-contact module packaging. Background technique [0002] With the continuous improvement of integrated circuit packaging technology, the integration level of integrated circuits is increasing day by day, and the functions are becoming more and more abundant. It is required to accommodate larger chips in a relatively small package size. Under the premise that the size and thickness of integrated circuit products remain unchanged, the packaging of some chips has reached the limit of packaging equipment and technology. For example, the current traditional contactless smart card modules used for contactless cards (such as public transportation cards, China's second-generation ID cards and most other applications) have an external...

AI Technical Summary

Problems solved by technology

However, with the continuous improvement of product requirements, many chips can no longer be packaged with traditional processes and materials.

[0003] Some people abroad have tried to change the standard and increase the size of the package body and module to realize the packaging of large-size chips, which alleviates the application of such large-size chips to a certain extent, but this method has changed most of the production process and requires A lot of money has been invested in the transformation of equipment and the production of new molds

It is more difficult to obtain mass promotion and application

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