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Colloid curing device

A curing device and colloidal technology, which is applied to the device, installation, optics and other directions of coating liquid on the surface, can solve the problems of damage to the workpiece 22, the inability to ensure that the colloid is completely cured, and fall, and achieve the effect of preventing damage

Inactive Publication Date: 2009-05-27
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the existing colloid curing device 20 has the following problems: on the one hand, the workpiece 22 can only be irradiated once by the curing lighting device 23, so that it cannot ensure that the colloid coated on the workpiece 22 is completely cured; on the other hand, when the conveyor belt 21 drives When the workpiece 22 moves from B to C, if the conveyor belt 21 does not stop running, the workpiece 22 will fall from the C of the conveyor belt 21 under the drive of the conveyor belt 21, resulting in damage to the workpiece 22

Method used

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Embodiment Construction

[0016] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0017] As shown in FIG. 3 , a glue curing device 30 provided by an embodiment of the present invention includes a curing lighting device 31 , a carrying device 32 and a sensing control unit 33 .

[0018] The curing lighting device 31 can be an ultraviolet light source for irradiating the workpiece 300 . In this embodiment, the workpiece 300 can specifically be a lens and a spacer ring (not shown) loaded in a lens barrel (not shown), and the contact surfaces of the lens and the spacer ring are coated with colloid.

[0019] The carrying device 32 is used to carry the workpiece 300 and transport the workpiece 300 . Specifically, the carrying device 32 includes a conveyor belt 321 and a carrying platform 322 for carrying the workpiece 300 . Wherein, the carrying platform 322 is fixed on the transmission belt 321 and driven by the transmission...

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PUM

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Abstract

The invention provides a colloid solidification device which is used for curing colloid coated on workpieces; the colloid solidification device comprises a load device used for carrying and conveying the workpieces coated with colloid, a solidification lighting device used for illuminating the workpieces carried and conveyed by the load device and curing colloid coated on the workpieces, and a sensing control unit which comprises two sensing units and a control unit; wherein, the two sensing units are arranged at the two sides of the workpiece along the transmission direction of the load device and can make synchronized motion along with the workpiece, so as to be used for sensing the positions of the workpieces and outputting the sense signals representing the positions of the workpieces to the control unit; the control unit receives the sense signals and controls the motion state of the load device according to the sense signals. The colloid solidification device can ensure the colloid coated on workpieces to be solidified and control the stroke of the workpieces to prevent the workpieces from falling off the colloid solidification device to be damaged.

Description

technical field [0001] The invention relates to a colloid curing device, in particular to a colloid curing device which has a high curing success rate and can control the stroke of a workpiece. Background technique [0002] A lens module applied to a camera or an optical instrument is usually composed of a lens barrel and a lens mount equipped with optical elements. see figure 1 The lens module 100 shown includes a lens barrel 120 , a lens group 121 , a spacer ring 122 , and a filter 123 . Wherein, the lens group 121, the spacer ring 122, and the optical filter 123 are tightly fixed together. [0003] During the assembly process of the lens module 100, the workpiece is generally fixed by dispensing, such as the optical filter 123 and the spacer ring 122. For details, please refer to A New Method of Flip Chip Assembly Using a Light Silver Filled Glue, Electronics Systemintegration Technology Conference , 2006.1 st , Publication Date: September 2006, Volume: 1, P540-543, t...

Claims

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Application Information

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IPC IPC(8): B05C9/12B05C11/00B05C13/02B05D3/06G02B7/02
Inventor 吕育翰
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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