Seedling cultivation substrate using mushroom residue as raw material and preparation method thereof
A technology for raising seedling substrates and mushroom residues, which is applied in the fields of botanical equipment and methods, soilless cultivation, cultivation, etc., can solve the problems of simple fermentation process and affect the quality of substrates, and achieves rich nutrition, improved physical properties, and enhanced porosity. Effect
Inactive Publication Date: 2010-12-01
INST OF SOIL & FERTILIZER XINJIANG ACAD OF AGRI SCI
View PDF2 Cites 8 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
This method still needs to consume commercial peat, and the fermentation process is simple, which affects the quality of the substrate
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreExamples
Experimental program
Comparison scheme
Effect test
Embodiment 1
Embodiment 2
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More
Abstract
The invention provides a seedling cultivation matrix taking mushroom residue as raw material, as well as a manufacture method thereof. The matrix comprises the following components in volume portion: 1 to 3 portions of mushroom residue, 1 to 2 portions of vermiculite, 1 to 2 portions of perlite and 0.0001 to 0.0005 portion of fermentation promoter, wherein the fermentation promoter is a mixture of decay promoting microbial agent and bran with the weight ratio of 1 to 10. The matrix has the advantages of fully utilizing mushroom residue waste of agricultural production, using no peat at all and saving ecological resources, along with rich nutrition, good porosity, excellent physical properties, low cost and simple manufacture.
Description
Seedling-raising substrate using mushroom dregs as raw material and preparation method thereof 1. Technical field The invention relates to a soilless cultivation technique, in particular to a seedling raising substrate using mushroom dregs as a raw material and a preparation method thereof. 2. Background technology With the progress and development of my country's facility agriculture, industrialized seedling raising technology has been promoted and applied from vegetable cultivation to garden plants and even field crops. The selection and preparation of seedling substrate is an important part of industrial seedling technology. At present, most seedling substrates use peat as the main raw material. However, since peat is a non-renewable resource with limited reserves, large-scale mining will cause devastating damage to the ecological environment. In order to avoid excessive exploitation of peat resources and improve the comprehensive performance of the substrate, research...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): A01G31/00
Inventor 张云舒徐万里刘骅周勃张殿宇
Owner INST OF SOIL & FERTILIZER XINJIANG ACAD OF AGRI SCI
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Patsnap Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com