Chip bearing belt and chip packaging construction

Abstract

A bearing belt for a chip comprises a flexible substrate. The flexible substrate is provided with a first surface provided with a first depressed structure, a second surface opposite to the first surface, and a patterning conducting layer arranged on the second surface.

Description

technical field [0001] The invention relates to a chip carrying tape; specifically, the present invention is a chip carrying tape applicable to chip packaging. Background technique [0002] Currently known chip carrier tapes are mainly applicable to TCP (tape carrier package) or COF (chip on film) packaging of semiconductor components (such as chips). A commonly used chip carrier tape is mainly composed of a flexible substrate (such as a polyimide (PI) substrate) and a metal conductive layer (such as a copper layer). Currently, in the process of using the chip carrier tape, it is often found that the chip carrier tape is warped. This phenomenon is mainly due to the fact that the chip carrier tape itself is made of a composite structure of different materials. Not only is it a soft material, but also the different materials between the layers have different thermal expansion coefficients. During the packaging process, due to temperature changes, different degrees of expansi...

AI Technical Summary

Problems solved by technology

This deformation may cause the chip carrier tape 1 to produce non-uniform deformation, and will generate shear stress between the polyimide substrate 11 and the copper layer 13, causing such as figure 1 warpage

[0004] This warping phenomenon will cause many disadvantages

For example, in the process of automatically installing chips on the chip carrier tape, if the chip carrier tape is warped to make it uneven, it will cause inaccurate positioning of the chip when installing the chip, resulting in the chip not being correctly installed on the chip carrier tape on, or even damage the chip or automation equipment

Or, if the chip carrier tape installed with the chip has warpage, it is not conducive to the subsequent application of the chip carrier tape. Due to warpage, problems such as difficult alignment, empty soldering or incomplete bonding will occur, which will affect the reliability of the overall component

Defective products with insufficient reliability will not be accepted by the market

[0005] From the above description, it can be known that in the prior art, the chip carrier tape often warps, which will cause the chip carrier tape to be uneven, thereby affecting the application of the chip carrier tape

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