Composite combining silica thermal repairing material and preparation method thereof
A technology of heat repair material and composite binder, which is applied in the field of composite bonded silicon heat repair materials, which can solve the problems of high thermal expansion coefficient of natural silica, pollution of glass liquid, and inability to quickly achieve effective welding of repaired parts, etc., to achieve plasticity and adhesion Strong, improved performance indicators, and conducive to the effect of hot repair operations
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0016] Prepare siliceous hot-filling material of the present invention: prepare and weigh the siliceous clinker aggregate (with SiO 47% of raw material gross weight) 2 95.0% waste silica bricks processed to the required particle size), 11% siliceous clinker powder (SiO 2 content of 95.0% waste silica brick processing); 26% natural silica powder (SiO 2 content of 96.0%), 3.5% white clay, 1.5% silica fume (SiO 2 Content is 92.0%), 11% composite binder. Among them, the natural silica powder 200-mesh sieve rate is 98%, the siliceous clinker powder 200-mesh sieve rate is 99%, and the white clay 325-mesh sieve rate is 98%. Pour the siliceous clinker aggregate, siliceous clinker powder, natural silica powder, white clay, and silica fume into the mixer in proportion to mix. After fully stirring, slowly add the prepared composite binder and continue stirring. Until it is fully mixed, it can be packed into bags. Secondary mixing is required before use to achieve the best constructio...
Embodiment 2
[0018] Prepare siliceous hot-filling material of the present invention: prepare 49% siliceous refractory aggregate (with SiO 2 Fused quartz with a content of 98.0% processed to the required particle size), 11% siliceous clinker powder (using SiO 2 98.0% fused silica processing); 25% natural silica powder (SiO 2 content of 96.0%), 3.5% of bentonite, 1.2% of silica fume (SiO 2 Content is 92.0%), 10.3% composite binder. Among them, the natural silica powder 200-mesh sieve rate is 98%, the siliceous clinker powder 200-mesh sieve rate is 99%, and the bentonite 325-mesh sieve rate is 98%. Pour the siliceous clinker aggregate, siliceous clinker powder, natural silica powder, bentonite, and silica fume into the mixer in proportion to mix. After fully stirring, slowly add the prepared composite binder and continue stirring until Mix well and pack into bags. Secondary mixing is required before use to achieve the best construction effect.
Embodiment 3
[0020] Prepare siliceous hot-filling material of the present invention: prepare 51% siliceous clinker aggregate (with SiO 2 Fused quartz with a content of 98.0% processed to the required particle size), 10% siliceous clinker powder (using SiO 2 98.0% fused silica processing); 25% natural silica powder (SiO 2 content of 96.0%), 2.5% of bentonite, 1.5% of white clay, 1.0% of silica fume (SiO 2 Content is 92.0%), 9% composite binder. Among them, the natural silica powder 200-mesh sieve rate is 98%, the siliceous clinker 200-mesh sieve rate is 99%, and the bentonite and white clay 325-mesh sieve rates are 98%. Pour the siliceous clinker aggregate, siliceous clinker powder, natural silica powder, bentonite, white clay, and silica fume into the mixer in proportion to mix. After fully stirring, slowly add the prepared composite binder and continue Stir until well mixed and pack into bags. Secondary mixing is required before use to achieve the best construction effect.
PUM
Property | Measurement | Unit |
---|---|---|
rate of change | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com