Heat radiating mechanism

Abstract

The invention relates to a radiating mechanism used for radiating for an electronic element which is arranged on the radiating mechanism; the radiating mechanism is provided with a radiating body and an interconnecting piece which are mutually connected, the interconnecting piece is provided with a plurality of pins, the radiating mechanism can be fixed on a print circuit board by the pins, the pins are mutually spaced, a filling opening is formed between each two adjacent pins and is filled with conducting material. In the radiating mechanism of the invention, a cellular type interconnecting piece is electrically connected with the print circuit board; the interconnecting piece is provided with a plurality of pins and is inserted and connected with corresponding inserting holes of the print circuit board by a plurality of pins, thus the radiating mechanism and the print circuit board can be jointed more tightly and steadily; furthermore, the more the filling openings are formed, the more conducting material is filled, thus increasing the conducting section area, reducing the resistance between the radiating mechanism and the print circuit board and effectively improving the electricity conducting efficiency and heat conducting efficiency.

Description

technical field [0001] The invention relates to a heat dissipation mechanism, in particular to a heat dissipation mechanism for heat dissipation of electronic components. Background technique [0002] During the working process of electrical appliances, some of the electronic components will generate high heat. If the heat cannot be dissipated for a long time, the electronic components in the high temperature environment are often difficult to work normally, which will affect the operation of the electrical appliances. In order to dissipate heat from electronic components in a timely manner, people have adopted various means of heat dissipation, such as accelerating the internal and external air circulation through fans to reduce the overall internal working temperature. For some electronic components that are prone to high heat, in order to dissipate them effectively and quickly, they can also be fixed on the heat dissipation mechanism, and the heat dissipation mechanism wi...

AI Technical Summary

Problems solved by technology

For some electronic components that are prone to high heat, in order to dissipate heat effectively and quickly, they can also be fixed on the heat dissipation mechanism, and the heat dissipation mechanism with good thermal conductivity can assist the heat dissipation of the electronic components. However, the traditional heat dissipation mechanism is used to There are very few filling holes for conductive materials, generally only one, and only 1-2 long pins are combined with the printed circuit board. Once any solder joint is loose, it is easy to cause the entire heat dissipation mechanism to fall off, and the connection is not good. stable

On the other hand, because there are too few filling holes, there are few conductive materials that can be filled, and the conduction and heat conduction cross-sectional area is small, so the heat dissipation and conduction efficiency will be limited.

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