Heat conducting module and manufacturing method thereof

A thermal conduction module and a manufacturing method technology, applied in cooling/ventilation/heating renovation, lighting and heating equipment, cooling/heating device for lighting devices, etc. And other issues

Inactive Publication Date: 2009-02-11
AMA PRECISION INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Since the side wall of the known heat conduction seat does not cover the entire periphery of the heat pipe, the bonding strength between the heat conduction seat and the heat pipe is quite low, and often due to the vibration during the moving or handling process, even if it is Severe loosening and separation
In addition, the heat pipe is only fixed by the coating of the side wall, and the bonding strength between the two is often insufficient. It is often necessary to use tin, lead and other low-melting point metals as solder, which leads to high pollution, material cost of solder, and heat conduction module. Process cost increase and other issues

Method used

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  • Heat conducting module and manufacturing method thereof
  • Heat conducting module and manufacturing method thereof
  • Heat conducting module and manufacturing method thereof

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Embodiment Construction

[0020] The detailed description and technical content of the present invention are described below with the accompanying drawings, but the attached drawings are only for reference and description, and are not intended to limit the present invention.

[0021] Please refer to figure 1 and figure 2 As shown, they are respectively a combination schematic diagram and a combination cross-sectional view of the present invention. The present invention provides a heat conduction module, including a heat conduction seat 10 and a heat pipe 20, wherein:

[0022] The heat conduction base 10 can be made of aluminum, copper or other materials with high thermal conductivity. The heat conduction seat 10 of this embodiment is in the shape of a flat plate, and a groove 11 is formed on the top surface thereof. On both sides of the groove 11, a first side wall 12 and a second side wall 13 are respectively extended upwards, the first side wall 12 is a short side wall, and the second side wall 1...

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Abstract

The invention relates to a heat conducting module and a manufacturing method thereof. The heat conducting module comprises a heat conducing seat and a heat pipe. A groove is formed on the surface of the heat conducting seat; two sides of the groove extend upwards to form two side walls; hooks which are buckled and connected with each other are arranged on the two side walls; and the heat pipe passes through and is accommodated in the groove on the heat conducting seat, and is wrapped and clamped by the two side walls. Therefore, the heat pipe and the heat conducting seat can be combined stably and solidly so as to enable the heat pipe and the heat conducting seat to be in hermetic contact, thereby enhancing the heat conducting effect of the heat conducting module.

Description

technical field [0001] The invention relates to a heat conduction module, in particular to a heat conduction module capable of conducting heat to a heat source and a manufacturing method thereof. Background technique [0002] With the progress and development of science and technology, the heat conduction module composed of heat conduction seat and heat pipe has been widely used in the heat conduction of LED lamps and heating components of computers. Among them, the heat pipe conducts heat through the heat conduction mechanism of gaseous state and liquid state, and its heat conduction speed is several times to hundreds of times higher than that of general metal materials, and it also has many advantages such as light weight, simple structure, and no need to provide electricity, so its usability is favored. Substantially improved. [0003] The known heat conduction module mainly includes a heat conduction seat and a heat pipe. The heat conduction seat is formed of a castable...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K7/12G06F1/20F21V29/00F21V29/51
Inventor 陈国星林暄智
Owner AMA PRECISION INC
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