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Arc source of dynamic controlled arc ion plating

An arc ion plating and dynamic control technology, applied in ion implantation plating, sputtering plating, vacuum evaporation plating, etc., can solve problems such as difficulty in popularization and application, improve discharge form and work stability, easy to popularize, low cost effect

Inactive Publication Date: 2009-02-04
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method needs to add a complex mechanical control mechanism, and involves many problems such as sealing and cooling, so it is difficult to popularize and apply

Method used

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  • Arc source of dynamic controlled arc ion plating
  • Arc source of dynamic controlled arc ion plating
  • Arc source of dynamic controlled arc ion plating

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] attached image 3 It is a schematic diagram of a dynamically controlled arc ion plating arc source device according to Embodiment 1 of the present invention.

[0060] The dynamically controlled arc ion plating arc source device mainly includes: target 1; target base 2; target bottom column 3; insulating ring 4; yoke 5; main control magnetic field generating device coil 6; water inlet 7; water outlet 8; arc starting coil 9; arc starting needle 10; auxiliary magnetic field generating device coil 11; shielding cover 12; bolt 13; The insulating ring 4 is used for the insulation between the bottom column 3 of the target and the coil 11 of the auxiliary magnetic field generator. The coil 6 of the main control magnetic field generator is set on the magnetic guide column 19 in the yoke 5 and placed behind the target 1 together. The coil 11 of the auxiliary magnetic field generator is set outside the cylinder of the target base 2 . The circulating water circulates through the ...

Embodiment 2

[0065] attached Figure 5 It is a schematic diagram of an adjustable statically controlled arc ion plating arc source device according to Embodiment 2 of the present invention. The basic structure is the same as that of Embodiment 1, except that the inner side of the top end of the magnetic tube 20 of the yoke 5 adopts an outward 15° slope structure, and the slope at the top of the magnetic column 19 is an axisymmetric boss shape (narrow at the top and wide at the bottom). ), the slope at the top of the magnetic cylinder is symmetrical to the slope at the top of the magnetic column, and the slope of the magnetic yoke is W-shaped. The coil 6 of the main control magnetic field generating device passes direct current to generate a certain arched magnetic field; the coil 11 of the auxiliary magnetic field generating device passes direct current of different sizes to generate a certain reverse magnetic field, and the coupling of the two magnetic fields generates static magnetic lin...

Embodiment 3

[0068] attached Figure 7 It is a schematic diagram of a dynamically controlled arc ion plating arc source device according to Embodiment 3 of the present invention. The basic structure is the same as that of Embodiment 2, except that the inside of the top end of the magnetic permeable cylinder 20 of the yoke 5 adopts a 30° outward slope structure.

[0069] The coils in the main control magnetic field generator and the auxiliary magnetic field generator are individually regulated by the voltage regulating power supply, the coil of the main control magnetic field generator passes a 2A direct current to form an arched magnetic field with a fixed configuration on the target surface, and the coil of the auxiliary magnetic field generator is turned on and off Directional alternating current adjusts the distribution of the arched magnetic field, the magnitude of the alternating current changes continuously (0-2A), and the direction remains unchanged, thereby continuously changing th...

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Abstract

The invention relates to the field of film preparation, in particular to an arc ion plating arc source which controls the movement of arc pit with dynamic magnetic field. The dynamic controlled arc ion plating arc source is provided with a dynamic control magnetic field generator, a target and a target base; the target is arranged on the target base; the dynamic control magnetic field generator consists of a main control magnetic field generator and an auxiliary magnetic field generator; the main control magnetic field generator is arranged behind the target and is coaxial with the target; the auxiliary magnetic field generator is arranged around the main control magnetic field generator. In the invention, arc-shaped magnetic fields which are dynamically distributed are formed on the target surface with the help of the cooperation of the two magnetic field generators, so as to improve the discharge form and work stability of the arc pit, control the movement track of the arc pit, improve the erosion evenness and target utility rate of the target, reduce the emission of large target particles and prepare high-quality film.

Description

technical field [0001] The invention relates to the field of thin film preparation, in particular to an arc ion plating arc source which uses a dynamic magnetic field to control arc spot movement. Background technique [0002] Arc ion plating is one of the most important technologies in industrial coating production and scientific research. Due to its simple structure and process, high ionization rate (70%-80%), high incident particle energy, and good diffraction, it can achieve low temperature A series of advantages such as deposition have enabled the rapid development and wide application of arc ion plating technology, showing great economic benefits and industrial application prospects. [0003] Arc ion plating is a coating technology based on the principle of gas discharge plasma physical vapor deposition. This technology relies on the local high temperature of the arc spot generated on the surface of the cathode target in the vacuum coating chamber, so that the cathode...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/32C23C14/35
Inventor 肖金泉郎文昌孙超宫骏杨英赵彦辉杜昊闻立时
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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