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Hot melt adhesive composition

A composition, hot melt adhesive technology, applied in the direction of adhesives, etc., can solve the problems of peeling or gelation, easy coking, poor temperature resistance, etc.

Active Publication Date: 2009-01-21
DOW GLOBAL TECH LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the high temperature performance of EVA copolymers is generally not good (poor temperature resistance) and when exposed to high temperatures in the presence of air, it is easy to scorch, peel or gel
Furthermore, the cohesiveness of EVA-based adhesives is not suitable for more demanding applications

Method used

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  • Hot melt adhesive composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0121] materials used

[0122] Nylon 6 is available as ULTRAMID B3 from BASF.

[0123] Polyethylene terephthalate (PET) is available under the trade name CRYSTAR 3924 from DuPont.

[0124] EVA-1 is a MI 400 ethylene / vinyl acetate copolymer (28 wt% VA).

[0125] EVA-2 is a MI 500 ethylene / vinyl acetate copolymer (18 wt% VA).

[0126] F-1 is an ethylene / maleic anhydride copolymer (E / MAH 85 / 15 wt %) having a MI of 205 and a melting point of 104°C.

[0127] F-2 is an ethylene / monoethyl maleate copolymer (E / MAME 90.5 / 9.5 wt %) having a MI of 30 and a melting point of 108°C.

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Abstract

A hot melt adhesive composition comprising: (a) a functional copolymer obtained from copolymerization of ethylene and a comonomer selected from maleic anhydride, citraconic anhydride, itaconic anhydride, tetrahydrophthalic anhydride, maleic acid, citraconic acid, itaconic acid, fumaric acid, tetrahydrophthalic acid, the corresponding salts, monoesters and diesters of these acids, and mixtures of any of these, wherein the functional copolymer is present in an amount from about 5 to about 95 weight % of the combined total amount of (a) and (b); and (b) at least one ethylene copolymer obtained from copolymerization of ethylene with a polar monomer wherein said polar comonomer is present in the copolymer in an amount of from 8 to 40 weight %, wherein said ethylene copolymer is selected from the group consisting of ethylene / vinyl acetate copolymers, ethylene / alkyl (meth)acrylate copolymers and ethylene / alkyl (meth)acrylate / carbon monoxide terpolymers, in an amount from about 5 to about 95 weight % of the combined total amount of (a) and (b); wherein the composition has a melt index of 100 grams / 10 minutes or higher. Articles comprising and process using the hot melt adhesive are also disclosed.

Description

[0001] Related Application Cross Reference [0002] This application claims priority to US Provisional Application Serial No. 60 / 755,567, filed December 30, 2005, the entire disclosure of which is incorporated herein by reference. field of invention [0003] The present invention relates to hot melt adhesive compositions comprising ethylene copolymers. The present invention also provides articles made using such hot melt adhesive compositions, such as cartons, boxes, trays, books, assembly products and disposable items. Background of the invention [0004] Hot melt adhesives are thermoplastics based on polymer compositions that liquefy at temperatures between 80°C and 220°C and solidify when cooled. Hot melt adhesives are desirable in that they cure quickly and / or do not have the aqueous or solvent medium that makes other types of adhesives fluid. They consist of dry polymers (less than 5% liquid) and are applied in the molten state without water or solvents. Hot melt ad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/08
CPCC09J123/0869C09J123/0853C08L2205/02C08L2666/06
Inventor R·T·乔
Owner DOW GLOBAL TECH LLC
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