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Method for manufacturing flexible printed circuit board and metallic wiring pattern of flexible printed circuit board using thereof

A technology of flexible printing and manufacturing method, which is applied in the manufacture of printed circuits, the formation of electrical connection of printed components, and printed circuits, etc., to achieve the effect of saving costs, preventing the decrease of electrical insulation resistance, and being economical.

Inactive Publication Date: 2010-12-29
ACQUTEK SAT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0021] The present invention has been made in view of the above problems, and its object is to provide a method of manufacturing a printed circuit board, which can suppress the sticking phenomenon, can easily form ultrafine circuit patterns, and can also minimize the amount of etching to improve Environmental protection issues and waste of copper resources, etc., thereby saving costs

Method used

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  • Method for manufacturing flexible printed circuit board and metallic wiring pattern of flexible printed circuit board using thereof
  • Method for manufacturing flexible printed circuit board and metallic wiring pattern of flexible printed circuit board using thereof
  • Method for manufacturing flexible printed circuit board and metallic wiring pattern of flexible printed circuit board using thereof

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Embodiment approach 1

[0074] Embodiment 1 relates to the manufacturing method of the single-sided flexible printed circuit board of the present invention; Embodiment 2 relates to the manufacturing method of the flexible copper clad laminate (FCCL) of the flexible printed circuit board of the present invention; Embodiment 3 relates to The manufacturing method of the double-sided flexible printed circuit board of the present invention.

[0075] FIG. 1 is a flowchart of a method for manufacturing a single-sided flexible printed circuit board according to Embodiment 1 of the present invention.

[0076] As shown in FIG. 1, the manufacturing method of a single-sided flexible printed circuit board according to Embodiment 1 of the present invention can be roughly divided into a step of providing an insulating sheet (S10), a step of forming a pattern (S20 to S40), and a step of forming a first plating layer. The step (S50), the step of removing the photoresist (S60), the etching step (S70), and the step of ...

Embodiment approach 2

[0094] Embodiment 2 can be directly applied to the conductor vapor deposition step (S20) in the conventional semi-additive method as shown in FIG. 5, the single-sided and double-sided A step (S10, S100) of providing a flexible copper foil laminate in the method for manufacturing a flexible printed circuit board.

[0095] First, in order to prepare flexible copper foil laminates by casting, the provided conductive layer 21 is a conductive layer made of metal such as copper with a thickness of 1-4 μm, preferably 2-3 μm, and has an insulating material 10 contacting surfaces.

[0096] Wherein, the reason why the thickness of the metal conductive layer 21 is limited is because if the thickness of the metal conductive layer 21 is greater than 4 μm, it is difficult to prevent the puddling phenomenon from occurring, and preventing the puddling phenomenon is also an object of the present invention; if If the thickness is less than 1 μm, it is difficult to form a wiring pattern, that i...

Embodiment 1

[0123] Utilizing the manufacturing method of the single-sided flexible printed circuit board of Embodiment 1 and Embodiment 2 at the same time, when manufacturing the wiring pattern, a copper metal conductive layer 21 with a thickness of 2 μm is provided on the copper metal conductive layer 21 with a thickness of 25 μm by the casting method. The insulating sheet 10 is used to prepare the FCCL, and then a photoresist 50 is coated on the metal conductive layer 21, followed by exposure and development. Then, a copper layer 22 is provided on the metal conductive layer 21 exposed by the patterning step, so that the overall thickness of the first plating layer 20 reaches 9 μm. Next, after removing the photoresist positive etching pattern 50', the metal conductive layer 21 is removed by soft etching, and then a nickel alloy is plated thereon to form a second plating layer 30 with a thickness of 0.2 μm, and then gold (Au) is plated thereon. A third plating layer 40 with a thickness of...

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Abstract

The invention relates to a method for manufacturing flexible printing circuit board by half addition style, and the flexible printing circuit board metal wiring pattern manufactured therefor. The metal wiring pattern of flexible printing circuit board for tape carrier semiconductor package is formed on insulation sheet and takes on multiple stripe appearance. At least one surface of the insulation sheet is plated orderly with a first clad layer- a copper layer, a second clad layer- nickel layer, a third clad layer- gold layer, the second clad layer and the third clad layer wraps upper surfaceand side surface of the first clad layer. The invention also discloses a method for manufacturing single-sided and double-faced printing circuit board for manufacturing the wiring pattern.

Description

technical field [0001] With the gradual development of electronic equipment in the direction of light weight, thinner, higher performance, and higher density, there is an increasing demand for circuit boards that are both light and thin and easy to install. However, due to the excessive hardness of the substrate itself, the existing printed circuit board is difficult to be configured on small electronic devices, and not only that, but also has the problem of heavy weight. For this reason, recently, a semiconductor package with a carrier using a flexible printed circuit board (Flexible Printed Circuit Board, FPCB) excellent in flexibility has attracted attention. [0002] This flexible printed circuit board is a thin and flexible printed board made of copper film and resin film. It was originally developed for military purposes such as missiles, and was later applied to civilian electronic equipment such as auto focus cameras. Taking this as an opportunity, due to its light we...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42H05K3/46H05K3/06
CPCH05K1/0393H05K3/0023H05K3/064H05K3/108H05K2201/10681
Inventor 洪淳盛李智远梁亨宇李大训姜建荣
Owner ACQUTEK SAT
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