Lamination-vacuum pressure pouring process of micro conductive retractor collar

Abstract

The invention discloses a lamination-vacuum pressure pouring technology of a microminiature conducting slip ring, which comprises the processing technology of a conducting ring, the processing technology of a brush holder and the general assembly technology of the microminiature conducting slip ring; after the conducting ring body and the brush component are inspected, the bought-in component inspection is carried out on the bought-in components such as a combination support, a flange, a dust shield, and the like; and then the conducting ring body, the brush holder component and the bought-incomponents are assembled into the microminiature conducting slip ring, and then tested and inspected; and after passing the inspections, the conducting ring body, the brush holder component and the bought-in components are packed and delivered. The lamination-vacuum pressure pouring technology of the microminiature conducting slip ring is characterized in that: after the conducting ring is manufactured and an insulating strip is processed, the conducting ring and the insulating strip are firstly laminated for assembly, epoxy resin is poured at the vacuum pressure, and then fine machining is performed on the conducting ring body. The lamination-vacuum pressure pouring technology of the microminiature conducting slip ring has the advantages that the two conducting rings are both mutually insulated and reliably connected, and rubber layers thereof can not fall off, the environmental suitability and operational reliability of the products are improved, the rate of defective products is low, and the performance of the product can correspond to that of the similar products abroad.

Description

technical field [0001] The invention relates to a conductive slip ring, in particular to a lamination-vacuum pressure casting process of a miniature conductive slip ring. Background technique [0002] The conductive slip ring is a precise electrical signal transmission device that realizes the multi-channel electrical signal (or current) transmission between two relative rotating mechanisms that requires no mutual interference. The conductive slip ring assembly is composed of a conductive ring body, a brush assembly, a combined bracket with precision bearings, a flange (or corresponding interface parts), and a dust cover. Its technical principle is: installed on the combined bracket equipped with precision bearings, there are multiple wires on the rotating mechanism in the rotating part connected to multiple mutually insulated conductive rings on the conductive ring body, and the brush assembly is installed on the combined bracket The relatively fixed part of the brush asse...

AI Technical Summary

Problems solved by technology

[0005] Among the above two manufacturing processes, the biggest advantage of the first manufacturing process is that the conductive slip ring components are firmly bonded into a whole through the bonding of epoxy resin to each conductive ring, and the conductive slip ring components are anti-vibration. It has a strong ability to resist harsh environments, and its performance is very stable, but its main problem is: when producing micro-miniature conductive slip ring components, this process relies on the vacuum pressure of epoxy resin to be poured onto the conductive ring body. The narrow gap (0.2mm) between the conductive rings is used to realize the bonding and insulation between the conductive rings. Because the gap between the conductive rings of the miniature conductive slip ring assembly is too small and the pouring depth is large (5mm), the epoxy resin When vacuum pressure casting is used to fill the gap, the casting pressure is different in the gap at different positions and at different positions in the same gap, and the conductive ring with a small thickness has very low rigidity, and it is difficult to resist the deformation of the conductive ring caused by different casting pressures. Side pressure, under the influence of this side pressure, each conductive ring will produce different degrees of deformation, so that the epoxy resin filling layer between the conductive rings is different between different conductive rings and in different positions in the same conductive ring gap. There is a big difference in the thickness of the epoxy resin filling layer, and there may even be empty glue in some places (that is, the epoxy resin cannot be filled)

The position where the empty glue position and the epoxy resin filling layer has the smallest thickness will become the part with the worst insulation performance between the two conductive rings. Therefore, when using this process to manufacture miniature conductive slip ring components The mutual insulation performance between them is relatively poor, and the production scrap rate is high

[0006] The biggest advantage of the second manufacturing process is that the insulation between each conductive ring is realized by the insulating sheet with good insulation performance placed between the conductive rings. Therefore, the insulation performance between any two conductive rings is reliably guaranteed; and the insulation The insulating sheet and the copper sheet of the conductive ring are glued together by adhesive glue, no vacuum equipment is required, the operation is simple, the manufacturing difficulty is small, and the production cost is low, but the main problem is: the insulating sheet and the conductive ring copper sheet are glued together by adhesive glue , when the laminations are combined, the glue layer between the laminations is prone to serious unevenness in the thickness of the glue layer due to the inconsistent lamination pressure during shaping, and the phenomenon of glue loss may even occur in some places. Therefore, the micro-sized Conductive slip ring components are subject to vibration for a long time, or when working under conditions of large temperature difference and frequent temperature changes, the adhesive layer is prone to peeling off, which affects the reliability of miniature conductive slip ring components.

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