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Liquid resin composition for electronic parts and electronic parts device

A technology for electronic parts and liquid resin, applied in the field of electronic parts and devices, can solve problems such as difficult and effective correspondence, and achieve the effects of high industrial value, good migration resistance and excellent reliability

Inactive Publication Date: 2008-11-26
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It has been known that the reduction of impurities in liquid resin compositions for electronic parts contributes to the improvement of mobility, but it is difficult to deal with them effectively only by using high purity.

Method used

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  • Liquid resin composition for electronic parts and electronic parts device
  • Liquid resin composition for electronic parts and electronic parts device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～7 and comparative example 1～2

[0066] Prepare (A) epoxy resin: bisphenol F type liquid epoxy resin (made by Dongdu Chemical Co., Ltd., trade name YDF-8170C) with epoxy group equivalent of 160, naphthalene type epoxy resin with epoxy group equivalent of 140 (big Japan Ink Industry Co., Ltd. product name HP-4032),

[0067] (B) Cyclic acid anhydride: a cyclic acid anhydride (trade name jER CureYH306 manufactured by Japan Epoxy Resin Co., Ltd., manufactured by Japan Epoxy Resin Co., Ltd.) that is liquid at room temperature and has an anhydride equivalent of 234. Comparative curing agent: a cyclic acid anhydride that is liquid at room temperature and has an acid anhydride equivalent of 166. Acid anhydride (trade name HN-2200 manufactured by Hitachi Chemical Industry Co., Ltd.).

[0068] Prepare latent curing accelerator: disperse microencapsulated amine in bisphenol A type epoxy resin, bisphenol F type epoxy resin curing accelerator (Asahi Kasei Chemical Co., Ltd. registered trademark Novacure HX-3921HP, curing ...

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Abstract

Disclosed is a liquid resin composition for electronic components which has good migration resistance, while being excellent in moldability and reliability. Also disclosed is an electronic component device which is sealed with such a liquid resin composition. Specifically disclosed is a liquid resin composition for electronic components, which contains an epoxy resin (A), a cyclic acid anhydride (B) which is in a liquid state at room temperature and has an acid anhydride equivalent weight of not less than 200, and a coupling agent (C).

Description

technical field [0001] The present invention relates to a liquid resin composition for electronic components suitable for sealing electronic components, and an electronic component device sealed therewith. Background technique [0002] Conventionally, in the technical field of element sealing of electronic components such as transistors and ICs, resin sealing has been the mainstream from the viewpoint of productivity and cost, and epoxy resin compositions have been widely used. The reason is that epoxy resin can balance various properties such as workability, formability, electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesion to inserts. Liquid resin compositions for electronic parts are widely used as sealing materials in semiconductor devices mounted with bare chips such as COB (Chip On Board), COG (Chip On Glass), and TCP (Tape Carrier Package). In a semiconductor device (flip chip) in which a semiconductor element is directly co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/42C08L63/00H01L23/29H01L23/31
CPCH01L2924/0002C08G59/42H01L23/295C08L63/00H01L2924/00C08K5/1539H01L23/29
Inventor 高桥寿登塚原寿富田教一萩原伸介
Owner RESONAC CORP
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