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Epoxy modified polyurethane cryogenic adhesive

A technology of epoxy modification and polyurethane, which is applied in the field of ultra-low temperature resistant adhesives and epoxy modified polyurethane ultra-low temperature resistant adhesives. The effect of constant mechanical properties and high bond strength

Inactive Publication Date: 2008-11-05
广东海拓创新精密设备科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under the harsh conditions of minus 200°C, the existing adhesives are difficult to meet the requirements of low temperature resistance mechanics and bonding properties, and it is difficult to overcome the brittleness and cracking of adhesives at low temperatures

Method used

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  • Epoxy modified polyurethane cryogenic adhesive
  • Epoxy modified polyurethane cryogenic adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The adhesive is prepared according to the following composition ratio (mass percentage):

[0023] Polyurethane modified prepolymer 30%

[0024] Epoxy 5%

[0025] Solvent (acetone) 10%

[0026] Chain extender 1,4 butanediol 15%

[0027] Expanded Vermiculite 2%

[0028] SiO 2 18%

[0029] CaCO 3 12%

[0030] CaCl 2 8%

[0031] The preparation method of this adhesive is:

[0032] 1. Mix the polyurethane modified prepolymer and the solvent and stir evenly in the reaction kettle, and pack it as component A;

[0033] 2. Add the above-mentioned mixed filler, chain extender and appropriate solvent to the epoxy resin, and gradually stir evenly, and pack it as component B;

[0034] 3. When bonding materials, add B to component A in proportion, and stir evenly, then apply and bond.

Embodiment 2

[0036] The adhesive is prepared according to the following composition ratio (mass percentage):

[0037] Polyurethane modified prepolymer 40%

[0038] Epoxy 5%

[0039] Solvent (acetone) 10%

[0040] Chain extender 1,4 butanediol 15%

[0041] Expanded Vermiculite 1%

[0042] SiO 2 5%

[0043] CaCO 3 14%

[0044] CaCl 2 10%

[0045] The preparation method of this adhesive is the same as in Example 1.

Embodiment 3

[0047] The adhesive is prepared according to the following composition ratio (mass percentage):

[0048] Polyurethane modified prepolymer 35%

[0049] Epoxy 12%

[0050] Solvent (methyl ethyl ketone) 15%

[0051] Chain extender MOCA 8%

[0052] Vermiculite 3%

[0053] SiO 2 15%

[0054] CaCO 3 10%

[0055] CaCl 2 2%

[0056] The preparation method of this adhesive is the same as in Example 1.

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PUM

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Abstract

The invention discloses an epoxy modified polyurethane ultra-low temperature resistant adhesive. The components and the mass percentage of the adhesive are: 30-50 percent of polyurethane modified prepolymer, 5-15 percent of epoxy resin, 10-20 percent of solvent, 1-15 percent of chain extender, and 30-50 percent of filler. First, uniformly blend all the liquid components, and then add solid components to uniformly blend, and pack after grinding on a grinding mill. The epoxy modified polyurethane ultra-low temperature resistant adhesive of the invention has the nature of ultra-low temperature resistance, the mechanical property of which can remain stabilized even being used for a long term at 200 DEG C below zero, and has the advantages of high bond strength and shear strength as well as good cohesiveness and corrosion resistance.

Description

technical field [0001] The invention belongs to the field of adhesives, and relates to an ultra-low temperature resistant adhesive, in particular to an epoxy-modified polyurethane ultra-low temperature resistant adhesive. Background technique [0002] With the sharp increase in the use of liquefied gases (such as: liquefied natural gas LNG, liquefied petroleum gas LPG, liquefied ethylene, liquid oxygen, liquid nitrogen, etc.), the bonding at ultra-low temperature between the cryogenic insulation materials matched with liquefied gases causes received high attention. Under the harsh conditions of minus 200°C, it is difficult for existing adhesives to meet the requirements of low temperature resistance mechanics and bonding performance, and it is difficult to overcome the problems of brittleness and cracking of adhesives at low temperatures. Contents of the invention [0003] In order to solve the technical problems of the existing adhesives at ultra-low temperatures, the pu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C09J9/00C08G18/10C08G18/42C08G18/48C09J163/00
Inventor 高延敏浦建光
Owner 广东海拓创新精密设备科技有限公司
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