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Laser processing device, positioning device; observing device and obserbing method

A laser processing and observation device technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as contrast reduction, illumination light refraction, identification of bubbles 105 and device patterns 103, etc.

Active Publication Date: 2008-10-01
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the air bubbles 105 exist, the illumination light will be refracted, and the image IB1002 of the portion corresponding to the air bubbles 105 will be darker than the surrounding area in observation.
If the amount of light irradiated is increased to brighten the bubble portion, transmission will also occur in the device pattern 103 portion, resulting in a decrease in contrast.
Therefore, there is still a problem that it is difficult to clearly identify the air bubble 105 and the device pattern 103 in the observation image I1002
[0013] And in the case of such transmitted illumination, due to the unevenness of the transmittance between the substrates (lots), and the contrast (the sharpness of the image of the device pattern observed and captured) when observing the device pattern different transparent substrates, resulting in unstable determination accuracy of the segmentation position

Method used

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  • Laser processing device, positioning device; observing device and obserbing method
  • Laser processing device, positioning device; observing device and obserbing method
  • Laser processing device, positioning device; observing device and obserbing method

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no. 1 approach

[0054]

[0055] Figure 1A , Figure 1B It is used to describe the observation method of the first embodiment of the present invention. In this embodiment, the observation object is such as Figure 1A As shown, on one main surface of a transparent substrate 1 such as sapphire, a diffusion layer 2 for diffusing the illumination light for observation is provided as a base layer, and a laminate 10 in which opaque device patterns 3 such as metal wiring and electrodes are formed , Take this as an example.

[0056] In addition, it may be a form in which a transparent semiconductor layer composed of a group III nitride such as GaN (gallium nitride) is provided between the transparent substrate 1 and the device pattern 3.

[0057] In addition, in this embodiment, as Figure 1A As shown, an adhesive plate 4 is pasted on the main surface of the laminated body 10 on the side where the device pattern 3 is formed, and the adhesive plate 4 side is fixed to a transparent stage 7 made of quartz...

no. 2 approach

[0088] In the above-mentioned embodiment, the case of observing the laminated body 10 in a state where, for example, the back side observation portion 50B of the laser processing apparatus 50 is simultaneously irradiated with the coaxial illumination light L1 with an incident angle of 90 degrees and the incident angle has been described This is the case of the oblique illumination light L2 at an acute angle, but the observation method is of course not limited to this.

[0089] FIG. 4 is a schematic diagram schematically showing the structure of a laser processing apparatus 500 according to the second embodiment. In addition, the same reference numerals are attached to the same configuration as the laser processing apparatus 50 of the first embodiment, and the description is appropriately omitted.

[0090] The laser processing apparatus 500 includes a control unit C composed of a general computer or the like. The control unit C is connected to each mechanism of the laser processing...

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Abstract

An observation method and an observation device capable of definitely identifying an opaque device pattern formed on a transparent substrate in an observation image d are provided. A bonding plate (4) is bonded to one side formed with the device pattern (3), the transparent substrate is fixed at a transparent carrying table (7) above which an axial transmission irradiation light (L1) and an inclined transmission irradiation light (L2) irradiate in an overlap manner, and the observation is performed via the carrying table (7) by using a back observation unit (6) from the lower direction of the carrying table (7); in the observation image, the dark (black) device pattern images and the bright part other than the device pattern images are observed corresponding to the device pattern (3). Furthermore, the part corresponding to bubbles are quite bright such that the shape of the device pattern (3) can be definitely determined in the observation image.

Description

Technical field [0001] The present invention relates to a technology capable of clearly identifying a device pattern (device pattern) provided on a transparent or semi-transparent substrate by observing an image. Background technique [0002] The following method has been known in order to use a brittle material with high hardness such as sapphire to form a device pattern such as a short-wavelength LD (laser diode) or LED (light emitting diode) on a substrate, and a pulsed laser is irradiated to form a device for dividing. Method of starting point (for example, refer to Patent Document 1). [0003] When the device disclosed in Patent Document 1 or other devices form the starting point for dividing the substrate into device chip units, an observation optical system composed of a CCD (Charge coupled device) camera or the like is used to align the substrate on the substrate. The set predetermined position reference object is observed and imaged, and based on the obtained imaging dat...

Claims

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Application Information

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IPC IPC(8): B23K26/03B23K26/02B23K26/40
Inventor 小川纯一栗山规由林和夫庭山博
Owner MITSUBOSHI DIAMOND IND CO LTD
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