Probe assembly, device for lapping bar and method for lapping bar

Abstract

The present invention provides a probe assembly, a grinding device which applies the elongated strip of the probe assembly and a method for grinding the elongated strip. According to the invention the probe assembly has the advantages of restraint to the electrostatic breakage of the elongated strip or the bad effect of the pollution, shortened preparing time and easy orientation between the probe and the electrode contact. The probe assembly related to by the invention comprises a probe which can do elastic bending deflection, and a braking member which provides bending deflection to the probe to generate a first bending deflection D1 at the front end part and prevents that the bending deflection at the front end part is less than the first bending deflection D1 and at the same time keeps the front end part in the first bending deflection D1, wherein, the front end part of the probes contacts with the electrode contact arranged on the surface except the grinding surface of the elongated strip by receiving a second bending deflection which has a direction same to that of the first bending deflection D1 and is larger than the first bending deflection D1 thereby establishing an electric connection between the probe and the electrode contact.

Description

technical field [0001] The invention relates to a probe assembly, a long bar grinding device and a long bar grinding method, and in particular to the structure of the probe assembly. Background technique [0002] In the manufacturing process of the thin-film magnetic head, it is extremely important to correctly control the grinding amount of the read-write element (MR element) by grinding the strips provided with the elements that will become the magnetic head slider. Therefore, there is a technology to configure the resistive film called RLG (Resistance Lapping Guide) sensor on the grinding surface of the strip, and measure the electrical impedance of the resistive film through the electrode contacts connected to the resistive film, and use an external Grinding is carried out while being monitored by the control device. Electrode contacts for extracting the RLG sensor and electrical impedance are generally provided on the cut portion of the elongated strip. [0003] In th...

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Problems solved by technology

[0005] However, in terms of the technique described in Patent Document 1, since an axial force acts on the needle, it is easy to bend, which causes problems such as difficulty in positioning

With regard to the technology described in Patent Document 2, because of the cost problem caused by the enlargement of the device, and the probes are oppositely crimped on the elongated bar, it is easy to apply excessive pressing force, and it is necessary to correct positioning, etc.

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