Method for measuring surface deformation under action of metal interconnection line force/electricity coupling

A metal interconnection wire and surface deformation technology, applied in the field of deformation detection and photometric mechanics, can solve the problems of complex optical system, difficult application, and easily damaged probes, etc., to achieve convenient data processing, convenient spatial positioning, and fast production speed. Effect

Inactive Publication Date: 2008-08-20
TSINGHUA UNIV
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AI Technical Summary

Problems solved by technology

The frequency of the grating produced by the mechanical scribing method is low and has high requirements for the movement accuracy of the scribing machine and the ambient temperature and humidity; the corrosion method, coating method, coating method, and replication method are difficult to apply to the special structure of the metal interconnection; AFM engraving

Method used

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  • Method for measuring surface deformation under action of metal interconnection line force/electricity coupling
  • Method for measuring surface deformation under action of metal interconnection line force/electricity coupling

Examples

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Embodiment 1

[0026] Take a sample of Al interconnection line deposited on polyethylamide flexible substrate. Stretch the shape of the sample, the length direction of the sample is parallel to the length direction of the Al interconnection wire, the effective working area is 8mm×4mm, and 250 Al wires are distributed in the working area, and the conductive silver glue is applied on both sides of the working area along the width direction, The two ends of these Al wires are respectively connected to form a parallel distribution, and at the same time, two thin wires are connected from the area coated with conductive silver glue. Select two Al interconnection wires from the sample, and use the focused ion beam microscope to fabricate orthogonal gratings with frequencies of 200l / mm and 1000l / mm on them by ion beam etching. It is 4mm×8μm.

[0027] Put the prepared grating sample into the force / electrical coupling loading system, set the pre-tightening force of 1N to make the sample tense; use an...

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Abstract

The invention discloses a method for measuring surface deformation under the action of interconnected metal wire force and galvanic coupling and belongs to the technical field of deformation detection and optical measuring mechanics. The method for measuring surface deformation under the action of interconnected metal wire force and galvanic coupling produces gratings on an interconnected metal wire surface by using an ion beam lithography method or an electron beam lithography method, implements loading by a force/electricity coupled loading system, captures grating images before the loading and in the loading process in real time by an optical microscope and an image collecting device, and obtains deformation information of the interconnected metal wire surface by a digital moire method, the wavelet transformation and the phase shift technique. The grating that is produced by the method for measuring surface deformation under the action of interconnected metal wire force and galvanic coupling has high quality and adjustable frequency shape, can exert multiple loads such as consistent stress/varying current, consistent current/varying stress, and consistent stress/consistent current fatigue, etc., on a test sample, has the advantages of real-time in-situ measurement, large measurement view, high sensitivity, no contact, simple operation, convenient data processing and high measurement precision, and has particular superiority in the research of the interconnected metal wire surface deformation.

Description

technical field [0001] The invention relates to a method for measuring surface deformation of metal interconnection wires under force / electrical coupling, and belongs to the technical fields of deformation detection and optical measurement mechanics. Background technique [0002] Today, with the development of VLSI and MEMS, the research on metal interconnection wires widely used in them is also deepening. These interconnection wires are often subjected to cyclic force / electricity / heat during micromachining preparation and use. and other multi-field coupling effects, the performance changes of metal interconnects under the action of external fields directly affect the service life and operational reliability of integrated circuits, micro-devices, and micro-equipment, and the performance changes of metal interconnects can usually be expressed through surface changes. Therefore, characterizing the surface deformation of metal interconnects under external field has become an ef...

Claims

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Application Information

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IPC IPC(8): G01B11/16G06T5/00G02B5/18
Inventor 谢惠民王庆华岸本哲戴福隆
Owner TSINGHUA UNIV
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