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Semiconductor-component sending and/or receiving electromagnetic radiation and housing-basebody for such a component

A technology for semiconductors and components, which is applied in the field of shell substrates and can solve the problems of light loss, separation of chip coating materials and shell substrates, etc.

Inactive Publication Date: 2008-07-16
OSRAM OPTO SEMICONDUCTORS GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Light loss due to additional reflective surfaces in the delamination area
In addition, in the worst case it may result in complete detachment of the chip encapsulation material from the housing matrix

Method used

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  • Semiconductor-component sending and/or receiving electromagnetic radiation and housing-basebody for such a component
  • Semiconductor-component sending and/or receiving electromagnetic radiation and housing-basebody for such a component
  • Semiconductor-component sending and/or receiving electromagnetic radiation and housing-basebody for such a component

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Embodiment Construction

[0027] In the figures, identical or identical functional components of the exemplary embodiment are shown identically in each case and are assigned the same reference numerals. In principle, the figures described are not necessarily intended to be properly scaled views of the actual device according to the invention.

[0028] The component shown schematically in FIG. 1 is a surface-mountable light-emitting diode component, which has a light-emitting diode chip 1 , optionally emitting further UV radiation, for example a GaN-based light-emitting diode chip emitting a visible blue light, which The chips also emit UV radiation, intentionally or unintentionally. Such components are in principle also suitable for use with other forms of light-emitting diode chips, such as components for emitting IR, which are particularly suitable for high temperatures.

[0029] The light-emitting diode chip 1 is mounted on an electrical chip connection part of a metal leadframe 6 and is connected ...

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Abstract

The invention provides a housing base body for a radiation-emitting and / or receiving semiconductor component having at least one radiation-emitting and / or receiving semiconductor chip. The housing base body has a recess for the semiconductor chip, in which recess the semiconductor chip can be encapsulated by an encapsulation compound. Wherein, the groove has a chip groove, in which the semiconductor chip is fixed. The recess also has a groove which at least partially surrounds the chip groove within the groove, so that the housing base body has a wall between the chip groove and the groove. Seen from the underside of the chip well, the top of the wall is below the level of the front side of the housing base body from which the recess enters into the housing base body.

Description

[0001] This application is a divisional application of Chinese patent application CN200480003170.X with the filing date of January 29, 2004, entitled "Semiconductor Components for Emitting and / or Receiving Electromagnetic Radiation and Housing Bases for Such Components". technical field [0002] This patent application claims priority from German patent application 10303727.6, the disclosure of which is hereby incorporated by reference. [0003] The invention relates to a housing base body for a semiconductor component that emits and / or receives radiation. Background technique [0004] Such semiconductor components are known, for example, from "Siemens" 29 (1991) Vol. 4, pages 147 to 149. As coating materials, for example, epoxy-based injection molding materials are generally used. But such injection-molded materials are often susceptible to attack by UV radiation. [0005] To improve the UV resistance of radiation-emitting and / or radiation-receiving opto-semiconductor com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L31/0203H01L23/04H01L33/48H01L33/52H01L33/54
CPCH01L33/486H01L33/52H01L33/54H01L2224/48091H01L2224/48247H01L2224/48472H01L2924/1815H01L2924/19107H01L2924/00014H01L2924/00H01L27/14
Inventor K·阿恩特G·博纳B·布劳纳G·维特尔
Owner OSRAM OPTO SEMICONDUCTORS GMBH
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