Cooling type packaging member production method and its applied cooling structure

Abstract

The invention discloses a preparation method for a radiation package and a radiation structure used by the radiation package, wherein the method mainly comprises the steps of connecting a semi-conductor chip to and electrically on a chip carrier, and connecting a radiation structure to the semi-conductor chip; and the radiation structure is provided with a covering layer on the surface and convexly provided with a supporting part on the edge, wherein, the plan view size of the radiation structure is larger than that of the completed package, so the chip carrier connected with the semi-conductor chip and the radiation structure are arranged in a mould cavity of a packaging mould which is filled with packaging materials so as to form a package colloid covering the radiation structure and the semi-conductor chip, wherein, when the mould flowing velocity of the lower part of the radiation structure is higher than that of the upper part of the radiation structure for pushing and pressing the radiation structure upwards, the supporting part is pressed against the top surface of the mould cavity, thereby preventing the radiation structure from warping; then the package colloid on the covering layer can be cut and removed according to the preset plan view size of the package, thereby forming the radiation package.

Description

technical field [0001] The invention relates to a method for manufacturing a semiconductor package, in particular to a method for manufacturing a heat dissipation package and the applied heat dissipation structure. Background technique [0002] With the demand for thinner, lighter and smaller electronic products, semiconductor packages integrating high-density electronic components and semiconductor chips of electronic circuits have gradually become the mainstream of packaging products. However, since the semiconductor package generates high heat during operation, if the heat of the semiconductor chip is not quickly released in real time, the accumulated heat will seriously affect the electrical function and product stability of the semiconductor chip. On the other hand, in order to prevent the internal circuit of the package from being polluted by external water and dust, the surface of the semiconductor chip must be covered with an encapsulant to insulate it. However, the ...

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Problems solved by technology

[0008] see again image 3 The area of ​​the heat sink of the aforementioned semiconductor package is very large. When the substrate 33 that has been connected with the chip 30 and the heat sink 31 is placed in the mold cavity 360 of the packaging mold 36 for packaging and molding operations, because the top of the heat sink 31 is available. The space through which the mold flow of the encapsulation resin passes is much smaller than that at the bottom, so the mold flow velocity under the heat sink 31 is much greater than the mold flow velocity above the heat sink 31, resulting in an unbalanced mold flow velocity between the top and bottom of the heat sink 31, which in turn leads to The heat sink 31 warps upward, resulting in poor appearance, or even destroying the adhesion between the heat sink 31 and the chip 30 to cause delamination, or affecting the quality of the electrical connection between the chip 30 and the substrate 33 (such as flip-chip electrical properties). Cracking of the solder bumps used to connect to the substrate)

[0009] Although it is possible to adjust and increase the space above the heat sink for mold flow to pass through, this will increase the amount of encapsulant above the heat sink, and the encapsulant above the heat sink must be removed in the subsequent process, which will lead to the loss of process materials. waste and cost increase

[0010] Therefore, how to provide a method for manufacturing a heat-dissipating package and its applied heat-dissipating structure, so as to avoid crushing the semiconductor chip and causing glue overflow during the encapsulation molding operation, and at the same time prevent the heat sink from warping during the encapsulation process Problems such as bending, even destroying the adhesion between the heat sink and the chip, the electrical connection between the chip and the substrate, as well as the waste of process materials and the increase in cost are issues that need to be solved urgently.

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