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Flexible circuit board press bonding method

A flexible circuit board and pressure technology, applied in chemical instruments and methods, lamination, printed circuits, etc., can solve problems such as difficult equipment and large area, and achieve the effects of improving peel strength, reducing glue overflow, and improving performance

Active Publication Date: 2008-07-02
靖江市华信科技创业园有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The disadvantage of the existing pressing method is that the area of ​​each layer of the existing pressing method is large, which puts forward quite strict requirements on the uniformity of the pressure, temperature and material properties of the equipment, so the existing equipment is difficult to fully meet the above-mentioned Require

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0067] The first step of lamination is as follows: figure 1 The process conditions of the laminated plate structure shown are as follows:

[0068] The pressing temperature process conditions of the first step of pressing are as follows:

[0069] Lamination Process Parameters

O

A

B

C

D

temperature(°C)

40

40

190

190

35

time (min)

0

10

55

85

135

[0070] The pressure process conditions of the first step of lamination are as follows:

[0071] Lamination Process Parameters

starting point

Paragraph 1

Paragraph 2

Paragraph 3

Pressure: Pa(×10 6 )

0.62

0.62

2.4

2.1

time (min)

0

10

70

20

[0072] The second step of lamination adopts such as Figure 4 The process conditions of the laminated plate structure shown are as follows:

[0073] Temperature: 180°C;

[0074] Press...

specific Embodiment approach 2

[0077] The first step of lamination is as follows: figure 1 The process conditions of the laminated plate structure shown are as follows:

[0078] The pressing temperature process conditions of the first step of pressing are as follows:

[0079] Lamination Process Parameters

O

A

B

C

D

temperature(°C)

70

70

170

170

45

time (min)

0

5

80

125

155

[0080] The pressure process conditions of the first step of lamination are as follows:

[0081] Lamination Process Parameters

starting point

Paragraph 1

Paragraph 2

Paragraph 3

Pressure: Pa(×10 6 )

0.80

0.80

1.8

1.8

time (min)

0

15

90

50

[0082] The second step of lamination adopts such as figure 1 The process conditions of the laminated plate structure shown are as follows:

[0083] Temperature: 170°C;

[0084] Pressu...

specific Embodiment approach 3

[0087] The first step of lamination is as follows: figure 1 The process conditions of the laminated plate structure shown are as follows:

[0088] The pressing temperature process conditions of the first step of pressing are as follows:

[0089] Lamination Process Parameters

O

A

B

C

D

temperature(°C)

100

100

155

155

60

time (min)

0

20

110

170

190

[0090] The pressure process conditions of the first step of lamination are as follows:

[0091] Lamination Process Parameters

starting point

Paragraph 1

Paragraph 2

Paragraph 3

Pressure: Pa(×10 6 )

0.40

0.40

0.55

2.4

time (min)

0

20

120

80

[0092] The second step of lamination adopts such as Figure 4 The process conditions of the laminated plate structure shown are as follows:

[0093] Temperature: 190°C;

[0094] P...

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Abstract

The invention discloses a method for pressing a flexible circuit board, which adopts a stacking structure to press the raw material of the flexible circuit board. The pressing method includes a pressing step A and a pressing step B. Using the two step pressing method of the invention can obviously reduce the glue-overflowed amount, lower the ratio of harmful bubbles increase the raising peeling strength and improve the performance of the flexible circuit board.

Description

technical field [0001] The invention relates to the manufacture of flexible circuit boards, in particular to a pressing method for flexible circuit boards. Background technique [0002] In recent years, the development of information and communication industries has driven the rapid development of the microelectronics industry. With the miniaturization of electronic products, various electronic components are also developing in the direction of miniaturization and miniaturization. Of course, flexible printed circuit boards carrying various electronic components are no exception, showing a trend of high-density development. The raw materials of flexible circuit boards generally include two layers of cover films and copper foil in the middle of the two layers of cover films. As the requirements for Flexible Printed Circuit (FPC) are getting higher and higher, the cover film used to protect copper foil also requires high bonding strength, heat resistance, acid and alkali resi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00B32B37/00
Inventor 邹凤华章颂云
Owner 靖江市华信科技创业园有限公司
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