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Packaging material composition

A technology for packaging materials and compositions, applied in other chemical processes, chemical instruments and methods, etc., can solve the problems of expensive materials, insufficient protection of LED devices, and high volatility of antioxidants

Active Publication Date: 2010-10-13
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the packaging materials for light-emitting devices must have homogeneity and high optical transmittance, and must pass long-term high-temperature storage and storage tests, the packaging materials for high-brightness LEDs must overcome the thermal yellowing caused by the high operating temperature derived from high current and other issues, and the epoxy resin currently used in LED packaging materials has a serious problem of thermal yellowing. In the long term thermal aging test (Long term thermal aging), the yellowing of the packaging material will cause a significant drop in short-wavelength light penetration , affect the light transmittance of the material and cause color shift, so the application of epoxy resin has great limitations in the environment of high power and high operating temperature
[0003] The anti-yellowing method of traditional transparent packaging materials such as epoxy resin is to add antioxidants, which function to remove peroxide radicals in the oxidation process to terminate the chain reaction, or decompose hydroperoxides in the oxidation process to slow down high Molecular cracking speed, but LEDs have long-term use requirements. It is found in experiments that antioxidants alone are not enough to solve the problem of high-temperature and long-term thermal yellowing resistance of LED packaging materials, and are suitable for the use of antioxidants in LED transparent packaging products. There are few types of selectivity, and some types of antioxidants are highly volatile, and migration is prone to occur in materials
[0004] In addition to antioxidants, US Patent Nos. 6,632,592B2 and 2005 / 0282976A1 also mention silicone epoxy as a packaging material, but the content of the silicone epoxy resin used is very high (high 40% by weight), because the material of organosilicon epoxy resin is expensive, it is a bottleneck in practical application and cost; The glass transition temperature (Tg) is not high, and the protection of LED devices is insufficient, so it is not conducive to the packaging of high-brightness LEDs
[0005] In addition, in U.S. Patent 6,507,049B1, it is proposed to use boroxine (boroxine) as a catalyst to replace the anhydride hardener in the general packaging material formulation, which can effectively reduce the yellowing of the material after hardening due to the anhydride hardener, and reduce yellowing. Variable coefficient and absorbance in the low-wavelength band of visible light (400-530nm), but the curing conditions of the packaging material containing this catalyst must be precured at 25°C for 16 hours. This curing time is too long, which is not conducive to mass production. , it is difficult to apply

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Formula Table:

[0043]

[0044]

[0045] Wherein the epoxy resin of non-siloxane is bisphenol A diglycidyl ether (Diglycidyl ether of Bisphenol A) (EPON-828, purchased from Shell chemical company), and the siloxane epoxy resin is (phenylmethylsiloxane) alkane-co-dimethylsiloxane)-triglyceryl ether terminated resin (Phenylmethylsiloxna e-co-dimethylsiloxne)-triglycidyl ether terminated) (GT-1000, purchased from Guangke Chemical Company), the anhydride hardener is formazan Methylhexahydrophthalic anhydride (MHHPA), catalyst is quaternary Quaternary phosphonium bromide (U-cat 5003, purchased from San-apro limited. company).

[0046] Put the catalyst (U-cat 5003) and hardener (MHHPA) in the formula table into the reactor, stir at room temperature for 1 hour; after the catalyst is dissolved, add epoxy resin (EPON-828>-1000) to the reaction In the container, stir at room temperature for 1 to 2 hours; then vacuum degas the uniformly mixed resin material for half an h...

Embodiment 2

[0049] Formula Table:

[0050]

[0051] The preparation method of the encapsulation material of embodiment 2 is the same as embodiment 1, and its difference is to add fluorescent whitening agent Chitex 127 (purchased from Double bond chemical company) in its formula, molecular structural formula is as follows:

[0052]

[0053] It is placed in a reactor together with the catalyst and the hardener, and after stirring for 1 hour at normal temperature, the subsequent steps are carried out.

[0054] The encapsulation material sample prepared in Example 2 was measured in the same manner as in Example 1, and the obtained yellowing coefficient changes are listed in Table 1.

Embodiment 3

[0056] Formula Table:

[0057]

[0058] The manufacturing method of the encapsulation material of embodiment 3 is the same as embodiment 2, and its difference is that the epoxy resin of non-siloxane used in its formula is cycloaliphatic epoxy resin (Cycloaliphatic epoxy) (4221EL, purchased from Dow chemical. company), and the siloxane epoxy resin it uses is also different from Example 2, which is GT-1250 (purchased from Guangke Chemical Company), which has the same chemical structure as GT-1000, but the difference is that its average ring The oxygen equivalent weight is 1150-1650g / equivalent.

[0059] The encapsulation material sample prepared in Example 3 was measured in the same manner as in Example 1, and the obtained yellowing coefficient changes are listed in Table 1.

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Abstract

The invention provides a packaging material composition, which comprises (a) 20 to 60wt% non-siloxane epoxy resin; (b) 5 to 50wt% siloxane epoxy resin containing aromatic siloxane 1 to 45wt%; and (c) 27 to 45wt% anhydride hardener. Additionally, the invention also provides another packaging material composition, which contains (a) 30 to 50wt% non-siloxane epoxy resin; (b) 5 to 50wt% alicyclic siloxane anhydride hardener; and (c) 27 to 45wt% anhydride hardener. The packaging material composition of the invention can be used for the transparent package material of a solid light emitting device,achieving the effect of long-time resistance to yellowing at high temperature.

Description

technical field [0001] The invention relates to an encapsulation material composition, in particular to an anti-thermal yellowing encapsulation material composition, which can be used as a transparent encapsulation material for solid-state light-emitting devices. Background technique [0002] In recent years, light emitting diodes (LEDs for short) have been gradually used in display backlights, vehicle light sources, large display panels and general lighting sources, and the demand for high-brightness LEDs is increasing day by day. Since the packaging materials for light-emitting devices must have homogeneity and high optical transmittance, and must pass long-term high-temperature storage and storage tests, the packaging materials for high-brightness LEDs must overcome the thermal yellowing caused by the high operating temperature derived from high current and other issues, and the epoxy resin currently used in LED packaging materials has a serious problem of thermal yellowi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K3/10C08L63/00C08K5/5415C08K5/524C08K5/353
Inventor 许嘉纹陈凯琪李巡天
Owner IND TECH RES INST
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