Lens two-sided glue assembly technology for mobile phone camera shooting module group of flexible circuit board

Abstract

The invention relates to a production and assembling technique of cellphone camera module, specifically to a dual adhesive tape assembling technique for cellphone camera module lens with flexible circuit wafer. According to the technical solution in this invention, the dual adhesive tape assembling technique for cellphone camera module lens with flexible circuit wafer comprises: A. assembling: to revolve the thread part on lens a into microscope base b; B. patching: to stick the image sensor e on flexible circuit wafer f and make bonding pad in the position; C. attaching the dual adhesive tape: to attach the dual adhesive tape d on the flexible circuit wafer f with image sensor e, and expose the image sensor e in the hollow position in the middle; D. installing the microscope base: to aim the registration mast c of the microscope base b towards the locating hole j on the flexible circuit wafer f, and press the microscope base b and make the microscope b agglutinate with the flexible circuit wafer f; E. hot riveting: to jumping the jut on the registration mast c of the microscope base b and doily g with rivet hot machine. The invention can save production man-hour and increase the one time yield of the production and provide convenient for the possible rework in future.

Description

technical field [0001] The invention relates to a production and assembly process of a camera module for a mobile phone, in particular to a process for assembling a double-sided adhesive tape for a lens of a camera module of a flexible circuit board. Background technique [0002] The assembly process of the flexible circuit board mobile phone camera module involves the assembly of the lens and the mirror holder, and the bonding of the mirror holder and the flexible circuit board. The image sensor is mounted on the flexible circuit board by SMD. During the assembly process of the mirror base and the circuit board, the ordinary assembly process uses glue such as epoxy resin, shadowless glue, etc. to bond the mirror base and the circuit board, and then Epoxy resin or UV glue is cured in an oven. Products processed by this process, if in the later performance test, once the assembly position of the lens or lens holder is found to be abnormal, or the product needs to be reworked ...

AI Technical Summary

Problems solved by technology

Because the epoxy resin and the shadowless glue produce chemical reactions during the curing process, the mirror base and the flexible circuit board are tightly adhered, and it is very difficult to disassemble. In actual production, most products can only be scrapped.

At the same time, due to the oven, especially the high-temperature oven, the pads connecting the image sensor and the bottom circuit substrate may be desoldered. Sometimes due to the contamination of oxides, the metal contact point becomes poor in conductivity after baking. Affecting the first-time yield of the product

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