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Parameter extraction method for MOS transistor radio frequency circuit simulated macro model

A technology of MOS transistors and radio frequency circuits, applied in the direction of electrical digital data processing, special data processing applications, instruments, etc.

Active Publication Date: 2012-06-06
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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AI Technical Summary

Problems solved by technology

At present, the "Π" type three-resistor network configuration method is widely used, and the specific structure is shown in As shown in Figure 1, the model mainly includes MOSFET 1' and three resistors R1, R2, R3 and two junction capacitors CSB, CDB constitute the substrate network 2', its applicable frequency can exceed 10GHz, but for higher frequency applications, Its performance is still not ideal

Method used

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  • Parameter extraction method for MOS transistor radio frequency circuit simulated macro model
  • Parameter extraction method for MOS transistor radio frequency circuit simulated macro model
  • Parameter extraction method for MOS transistor radio frequency circuit simulated macro model

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Embodiment Construction

[0034] The MOS transistor radio frequency circuit simulation macro model and its parameter extraction method of the present invention will be further described in detail below.

[0035] Such as figure 2 As shown, the present invention uses a MOS transistor radio frequency circuit simulation macro model to simulate a MOS transistor radio frequency circuit, and the simulation circuit has a gate node G, a source node S, a drain node D and a substrate node B. The MOS transistor radio frequency circuit simulation macro model includes a MOS transistor simulation model 1, a MOS transistor gate connected in series with the simulation circuit gate node G, used to characterize the gate resistance R between the transistor gate and the contact hole electrode G , the source junction capacitance C used to characterize the junction capacitance and parasitic resistance between the source and substrate jun.s with the first substrate resistance R jun.s , the drain junction capacitance C used...

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Abstract

The invention provides a MOS transistor radio-frequency circuit simulation macro model and a parameter extraction method thereof. The simulation macro model comprises a MOS transistor simulation model, a gate resistor RG connected between a transistor gate node and a circuit grate node in series, a capacitor Cjun.s and a resistor Rjun.s and a capacitor Cjun.d and a resistor Rjun.d respectively indicating the a source electrode and a substrate, as well as the junction capacitance and parasitic resistance therebetween, and two resistor Rbulk and Rwell respectively indicating bulk resistance and trap resistance of the transistor. The four resistors Rjun.s, Rjun.d, Rbulk and Rwell are connected at one point, and indicate the parasitic resistance introduced by the substrate with a T-shaped structure. The invention also provides a method for extracting parameters of each element of a substrate network structure in the macro model using the equivalent circuit Y-parameter analytic method. The invention simulation macro model is suitable for frequency up to 20GHz, improves model accuracy of the MOS transistor in 20GHz high frequency domain, and expands the frequency application range of CMOS circuit EDA design.

Description

technical field [0001] The invention belongs to the field of integrated circuits, in particular to a MOS transistor radio frequency circuit simulation macro model and a method for extracting substrate network structure parameters. Background technique [0002] With the increasing application of CMOS technology in the radio frequency (RF) field, the accuracy of high frequency models of MOS devices is becoming more and more important for RF product design. Since the parasitic effects of MOS devices are more complex at high frequencies and have a greater correlation with the layout, the current practice is to build high-frequency models for MOS devices in the form of macro models. [0003] The BSIM3SPICE model, as the industry standard of CMOS models, has significant deficiencies in both simulation and RF performance. Its RF model does not include non-quasistatic effects, and the model structure does not include gate resistors and substrate resistor networks. Therefore, it is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
Inventor 胡少坚任铮
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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