Method for manufacturing three-dimensional nerve microelectrode

Abstract

The invention relates to a process for producing three-dimension nerve microelectrode, belonging to micro mechanical-electric technical field. The invention comprises using silicon chip as substrate, grows a bottom layer SiO2 at the front face of the silicon chip, forming a metal alloy layer on the bottom layer SiO2 and etching metal interconnecting lines, press welding points and contact round points, then growing a top layer SiO2 at the front face of the bottom layer, using buffer HF acid solution to etch the top layer SiO2, to expose the press welding points and the contact round points, and using photo resist to stuff the press welding points, rotationally coating SU-8 adhesive at the front face of the silicon plane structure of the contact round points, via photo-etching and etching techniques to form a cylinder holes, and using photo resist to stuff the press welding points, plating and growing metal in the cylinder holes, to form metal cylinders, uses development to remove the photo resist in the press welding points to expose the press welding points, and finally washing to obtain three-dimension multi-path microelectrode array. The invention can reduce production cost, improve the height controllability of microelectrode, and improve the consistence of each path.

Description

technical field [0001] The invention relates to a processing method in the field of micro-electromechanical technology, in particular to a method for manufacturing a three-dimensional nerve microelectrode based on a micro-electromechanical processing technology. Background technique [0002] For many patients with severe neurological damage, traditional drug therapy and other methods cannot cure nerve damage. At the same time, nerve repair methods based on artificial electronic devices have been widely studied and applied. As the interface components between artificial electronic devices and biological tissues, neural microelectrodes are playing an increasingly important role in the field of neural repair such as motor function and sensory function. In the study of artificial hearing restoration, microelectrodes implanted in the cochlea are used to directly stimulate the remaining auditory nerve fibers, and send neural electrical signals to the auditory center of the brain t...

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Problems solved by technology

[0003] Found through literature search to prior art, Peter Norlin et al published on Journal ofmicromechanics and Microengineering (micromechanics and microengineering periodical) (2002, 12 phases, 414-419 pages) ("A 32-site neural recording probe fabricated by DRIE of SOI substrates") (fabrication of 32 recording point electrodes on SOI substrates), this article proposes to use silicon deep etching process to fabricate silicon microelectrodes, the specific method is to use deep reactive ion etching (DRIE) technology to determine the electrode structure, SiO 2 and Si 3 N 4 As an electrical insulating layer, its disadvantage is that the microelectrode is a planar structure, and the insulating layer is greatly affected by the process, which is prone to pinholes, which is not conducive to long-term implantation in the body.

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