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Carbon black conductive fluid

A technology of conductive liquid and carbon black, used in printed circuits, electrical components, conductive materials dispersed in non-conductive inorganic materials, etc., can solve problems such as air pollution and poor paint adhesion, and achieve less air pollution and adhesion. Good, strong effect against external environmental influences

Inactive Publication Date: 2008-04-23
深圳市合力泰光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the invention is to solve the problems of poor coating adhesion and easy air pollution in the prior art, and provide a kind of carbon black conductive liquid with good adhesion and low VOC

Method used

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Embodiment Construction

[0028] The invention provides a carbon black conductive liquid, which comprises the following components in parts by weight: 0.1-50 carbon black, 0.01-15 dispersant, 0.01-15 binder, and 50-99 aqueous dispersion medium.

[0029] The average particle diameter of the carbon black of the present invention is in the range of 10nm-20μm, preferably in the range of 15nm-5μm, more preferably in the range of 20nm-5μm, still more preferably in the range of 30nm-3μm, or less than 1.5 μm . The carbon black used in the present invention can be synthetic or natural. There are no special restrictions on the production and processing methods of carbon black, which can be furnace method, slot method and other processes.

[0030] The dispersant of the present invention can be anionic dispersant, nonionic dispersant dispersant and amphoteric dispersant, wherein anionic dispersant comprises inorganic anionic dispersant and organic anionic dispersant, and inorganic anionic dispersant can be polyph...

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Abstract

The invention comprises (based on unit weight percent): carbon black 0.1-50, disperser 0.01-15; binder 0.01-15; aquosity dispersion medium 50-99.

Description

technical field [0001] The invention relates to a carbon black conductive liquid. Background technique [0002] At present, the technology of forming a conductive coating on an insulating substrate is more and more widely used in the fields of electronic circuits and display technologies. In the manufacture of printed circuit boards (PCB), especially in the production of multilayer boards, the conduction between layers is involved, and hole metallization treatment is required. For a long time, the electroless copper deposition technology has been the mainstream technology to achieve hole metallization. It is an autocatalytic redox reaction, which has the problems of difficult wastewater treatment, serious pollution, difficult quality control and high operating costs. Chinese patent CN1063395A discloses a non-chemical plating hole metallization process, which adopts the process of forming a conductive coating on the insulating layer in the hole first, and then electroplating...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/18H01B1/24H05K3/00
Inventor 魏丽琴张玉梅
Owner 深圳市合力泰光电有限公司
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