Method for increasing metal magnetic multilayer film coercive force
A metal magnetic, multi-layer film technology, applied in metal material coating process, coating, ion implantation plating and other directions, can solve the problems of small increase in film coercivity, increased production cost, unfavorable application, etc. Good perpendicular magnetic anisotropy, low cost, small thickness
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[0009] As shown in Figure 1, the sputtering process condition of the curve (a) is: the background vacuum degree of the sputtering chamber is 1×10 -5 Pa, the pressure of argon (99.99%) during sputtering is 0.9Pa. During the sputtering process, a magnetic field perpendicular to the film surface is applied to the surface of the substrate, with a magnitude of 100Oe, and the substrate rotates at a rate of 18r / min; the substrate temperature is 100°C, and the deposition temperature of the FeMn layer is 10°C;
[0010] The sputtering process condition of curve (b) is: the background vacuum of the sputtering chamber is 3×10 -5 Pa, the pressure of argon (99.99%) during sputtering is 1.2Pa. During the sputtering process, a magnetic field perpendicular to the film surface is applied to the surface of the substrate, with a magnitude of 700 Oe, and the substrate rotates at a rate of 18r / min; the substrate temperature is 200°C, and the deposition temperature of the FeMn layer is 30°C;
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