Copper alloy having high strength and high softening resistance

Abstract

Disclosed is a Cu-Fe-P alloy capable of enabling high strength, high electrical conductivity, and excellent softening resistance to coexist. The Cu-Fe-P alloy is suitable for use as a constituent material of a lead frame for a semiconductor device. With the Cu-Fe-P alloy with strength rendered higher by micronizing Fe-containing compounds, when enhancing softening resistance by increasing Sn content so as to exceed 0.5 mass%, at least one element selected from the group consisting of Ni, Mg, Ca, Al, Si, and Cr, in trace amounts, are caused to be additionally contained to thereby check cracking likely to occur at the time of forging and hot rolling in a process of producing the copper alloy, as a result of an increase in the Sn content.

Description

technical field [0001] The present invention relates to a copper alloy having high strength and high softening resistance, such as a copper alloy suitable for use as a constituent material of a lead frame for a semiconductor device. The copper alloy according to the present invention is used not only as a constituent material of a lead frame but also as a constituent material of electric and electronic parts such as semiconductor parts other than lead frames for semiconductor devices, printed wiring boards, etc., other electric and electronic parts such as switches including , buses, terminals, connectors and other mechanical components of the material. However, in the following description, as a representative application example, the case where the copper alloy is specifically used for a lead frame as a semiconductor component will be mainly described. Background technique [0002] As copper alloys used for IC lead frames, Cu-Fe-P alloys have generally been used in the pa...

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Problems solved by technology

[0007] However, the material subjected to such treatment tends to soften and cannot maintain the mechanical strength before heat treatment