Reflow furnace

A technology of reflow furnace and atmosphere gas, which is applied in the field of reflow furnace of atmosphere purification device, which can solve the problems of heater 115 power consumption, large energy loss, and conflict of energy saving, and achieve the effects of not easy failure, high-efficiency combustion, and shortened lag time

Inactive Publication Date: 2007-12-12
TAMURA FA SYST
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the electric power of the heater 115 is greatly consumed, contrary to energy saving
[0011] In the prior art of oxidative treatment of flux gas, since the flux is actively oxidized and decomposed by heating the atmosphere gas with a combustible material, the temperature of the treated gas becomes higher, and other additional measures such as cooling the high-temperature gas are required. processing, so there is a problem of large energy loss

Method used

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Embodiment Construction

[0088] The reflow furnace of the present invention will be described with reference to the drawings.

[0089] One aspect of the reflow furnace of the present invention is to provide a reflow furnace including: a transport device for transporting a circuit board on which electronic components are mounted; and a heating chamber for transporting the circuit board inside and heating the circuit board through an atmospheric gas to perform soldering. An atmosphere purification device having: a device for extracting a part of the atmosphere gas containing a flux component vaporized in the brazing, a device for heating the extracted atmosphere gas to a desired temperature, and making the heated atmosphere gas An oxidation catalyst for burning the flux components contained in the flux, a device for controlling the oxygen concentration of the high-temperature gas after the combustion treatment, and a device for returning the high-temperature gas with the controlled oxygen concentration a...

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Abstract

The present invention provides a reflow furnace which can control temperature of heating chamber without special cooling device, and reduce heating amount of heating chamber with flux component contained in the heated ambient gas burned efficiently. The reflow furnace comprises: carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, a control device to control an oxygen concentration in a high temperature gas after being burned, and a returning device to return the high temperature gas with the oxygen concentration controlled after being burned to the heating chamber.

Description

technical field [0001] The present invention relates to a reflow furnace for soldering circuit boards on which electronic components are mounted, and more particularly to a reflow furnace equipped with an atmosphere cleaning device for efficiently burning flux components vaporized in solder and mixed in atmosphere gas. Background technique [0002] Various electronic components are electronic components called SMD (surface mounted device), and are directly mounted and soldered on the surface of a circuit board. This brazing is performed with solder paste. Solder paste is made of paste flux and powder solder, which is applied on the soldered part of the circuit board by printing or dispenser, and electronic components are mounted on it, and then heated and melted in a reflow furnace, thereby The circuit board and electronic components are soldered. [0003] The flux of the solder paste can remove the oxide film on the surface of the metal to be brazed, prevent re-oxidation ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/012B23K3/08B23K3/04B23K101/42
CPCB23K1/0016B23K1/012B23K3/08B23K2201/42B23K1/008B23K2101/42
Inventor 浅井稔之山根基宏松冈孝幸田中厚
Owner TAMURA FA SYST
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