Apparatus and method for measuring widthwise ejection uniformity of slit nozzle

Abstract

The invention relates to a device and a method used for measuring the injection evenness of a photoresist injected by a slit nozzle of a substrate coating apparatus, and according to the transverse injection evenness measurement apparatus of the slit nozzle provided by the invention, the invention comprises a plurality of fluid pressure measurement units which are provided with detection surfacesthat are opposite to an injection outlet of the slit nozzle, and the fluid pressure measurement units are arranged horizontally along the slit nozzle.

Description

Device and method for measuring lateral spray uniformity of slit nozzle technical field The invention relates to a device and a method for measuring the lateral spraying uniformity of photoresist ejected from a slit nozzle (Slit Nozzle) of a substrate coating device (Substrate Coating Apparatus). A device and method for lateral spraying uniformity of photoresist sprayed out along the lateral direction of a slit nozzle during resist resisting. Background technique Usually, when manufacturing a liquid crystal display device, process errors mainly occur in a photolithography process using a photoresist (Photoresist). If the photoresist is not uniformly coated, differences in resolution, circuit line width, and reflectivity differences occur in subsequent processes, causing defects directly reflected on the screen. Recently, there has been a demand to shorten the process time required to coat a photoresist on a substrate. Accordingly, it is necessary to study a method of un...

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Problems solved by technology

However, since this method directly coats the photoresist PR on the substrate, it will cause waste of expensive substrates and photoresist PR.

In particular, as the size of the substrate increases, the amount of photoresist PR consumed will further increase

Moreover, when measuring the thickness of the photoresist PR applied on the substrate, it is difficult to measure the thickness of the photoresist PR in the state where the photoresist PR applied on the substrate is not yet dry.

Therefore, the thickness of the coated photoresist PR needs to be measured after the drying process, which makes the work of measuring the thickness of the coated photoresist PR very cumbersome

In particular, since the thickness of the applied photoresist PR is measured after it goes through the drying process, it is not possible to directly measure the thickness of the actually applied photoresist PR, so that the ejection uniformity of the photoresist cannot be directly measured

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