Variable position cooling apparatus

Abstract

A device for cooling a heat-dissipating component comprising an expansion chamber (16) that is expandable between a first volume and a second volume. The expansion chamber adjusts its surface exposure to ambient air according to the operating conditions of the device.

Description

Background technique [0001] As electronic systems become more compact, there is an ongoing desire to increase the rate of heat transfer away from heat dissipating components. While there are many heat transfer techniques conceived for compact devices, it is difficult to provide adequate cooling for the components within the available space within the device. [0002] Although forced air convection has been used in small electronic devices such as laptop computers, the forced air convection method has practical limitations. In forced air systems, the volume of air required to provide adequate cooling often creates undesirable noise levels and can drain battery life in portable devices. [0003] Another method used to cool heat sink components involves the use of fluids in heat transfer bags. Heat transfer bags are typically made of a flexible, durable, air-impermeable film. These bags are filled with a heat-conducting fluid and are usually placed between the heat-generating ...

AI Technical Summary

Problems solved by technology

[0004] Although heat transfer bags have been used in some cooling systems, the use of heat transfer bags in small electronic devices such as laptop computers has been limited at least in part because of the limited amount of space available within computer cases and their Surface area requirements for effective cooling

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