Device and method for restraining the titanium precious stone laser amplifier parasitical surge

Abstract

The invention relates to a method of suppressing the titanium gem laser amplifier parasiteic oscillation and equipment, the equipment characteristicis is that including a hull shape support which is used for installing the titanium gem crystal, on the lateral wall of the hull shape support has drop liquid hole and air hole for filling the liquid matching matter. The characteristic of the invention is that the liquid mathing matter is easy to collocate, and even contact with the side face of titanium jewel, without gas bubble, have no special request of the titanium gem crystal side face, most of all easy to replace, can not cause the damage to the crystal plane, the invention also has low cost, simple operate merit.

Description

technical field [0001] The invention relates to a Ti:Sapphire laser, in particular to a device and method for suppressing parasitic oscillation of a large-scale Ti:Sapphire amplifier. Background technique [0002] With the continuous development of strong-field ultrafast science, the requirements for the energy and intensity of ultra-intense and ultra-short laser sources continue to increase. In femtosecond-level ultrafast laser systems, based on the chirp Chirp Pulse Amplification (CPA) is the main technical route to achieve the above goals, and the large-scale Ti:Sapphire amplifier is the main source of high energy output, so it becomes one of the key links of this system. As the size of the Ti:Sapphire crystal increases, the maximum energy that the crystal can output also increases, but at the same time, due to the increase in the lateral size of the crystal, the Fresnel reflection on the crystal surface causes laser oscillation between the sides (called parasitic oscilla...

AI Technical Summary

Problems solved by technology

However, we found that in order to suppress the parasitic oscillation well, the matching glue must be in good contact with the side of the crystal without air bubbles, otherwise, the reflection of spontaneous emission fluorescence on the side is still relatively high, which is easy to form parasitic oscillation, which requires The side of the crystal must be polished so that the solid glue can make good contact with the side of the crystal

At the same time, the speed of glue filling, the temperature of crystal and glue, and the overall cooling process must be well controlled, otherwise, it is easy to generate air bubbles, so the operation is more complicated

In addition, after working for a period of time, the carbon powder in the colloid will be bleached due to absorption, resulting in a decrease in absorption efficiency. It is necessary to replace the matching glue, and then the crystal needs to be heated again. After the glue becomes liquid, suck it out, and then fill it with new glue

If the crystal shows damage, needs to be re-polished, the coating needs to be removed from the bracket, or the O-ring needs to be replaced, it must be operated at 110°C. The difficulty can be imagined. In addition, in case of glue filling process If you accidentally drop the glue on the surface of the crystal, it will be difficult to clean up and cause damage to the crystal

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