Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Packing component for decreasing electromagnetic-wave disturbance

A technology for packaging components and components, which is applied in the field of packaging components to prevent electromagnetic wave interference, and can solve the problems of assembly difficulty and cost increase.

Active Publication Date: 2007-09-05
CYNTEC
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although this method can achieve a better heat dissipation path, the disadvantage is that the assembly is difficult and the cost will increase

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packing component for decreasing electromagnetic-wave disturbance
  • Packing component for decreasing electromagnetic-wave disturbance
  • Packing component for decreasing electromagnetic-wave disturbance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] Some embodiments of the present invention are described in detail as follows. However, the present invention can be widely implemented in other embodiments other than those described in detail, and the scope of the present invention is not limited, which is subject to the scope of the following patents.

[0035] First, FIG. 3 shows a preferred embodiment disclosed in the present invention, a schematic cross-sectional view of a packaging structure with a shielding structure disclosed in the present invention. The packaging component with a shielding structure includes a substrate 10 without wiring, a shielding structure 12 located on the lower surface of the substrate 10 without wiring, an insulating layer 14 located under the shielding structure 12, and a lead frame 20 with pins 22 located on the bottom surface of the substrate 10 without wiring. On the upper surface of the substrate 10 , the plurality of first components 24 are disposed on the lead frame 20 and the plu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention is concerned with encapsulation component to reduce the disturb of electromagnetic wave, relating to base plant, shadowing structure and insulating-layer under the base plant one by one, and there is crossing-hole filled with conductor to guide the base plant and shadowing structure. Some lead frame with leading foot set on the base plant, and the second base plant is at front of two lead frames. Some the first components set on lead frame, the second component set on front of the second base plant, and the said components connect with each other by lead. The local base plant, the first and the second component and local lead frame are airproofed with molding compound, thus the encapsulation component releases electromagnetic wave / radio frequency to the outside of encapsulation component to reduce interfering to other components in the system, through lead frame, conductor inside of base plant, shadowing structure and grounding end.

Description

technical field [0001] The present invention relates to a packaging component, more particularly to a packaging component that prevents electromagnetic wave interference. Background technique [0002] With the rapid development of electronic technology, electronic devices have been widely used in various fields of human life. With the wide application and development of electronic equipment, a relatively derived issue is the discussion of the electromagnetic interference generated by these electronic equipment and the suppression of interference from non-self-generated interference. Therefore, it is necessary to use electromagnetic compatibility as a problem that needs a lot of discussion at present. . Its purpose is to ensure that the electronic components in the system cannot affect other electronic equipment during operation through the component itself or the system design, resulting in a reduction in work performance or damage to its internal components. [0003] Gene...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L25/00H01L23/552H01L23/488
CPCH01L2924/19107H01L2224/48247H01L2224/48227H01L2224/48137H01L2924/30107H01L2924/3025H01L2924/181H01L2924/00H01L2924/00012
Inventor 温兆均陈大容林俊良戴志展
Owner CYNTEC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com