Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Laser processing method and laser processing apparatus

A laser processing method and laser processing technology, which can be used in fine working devices, laser welding equipment, stone processing equipment, etc., can solve problems such as difficulty in improving processing capacity, and achieve the goal of preventing significant reduction, improving processing productivity, and increasing scanning speed. Effect

Inactive Publication Date: 2007-08-29
MITSUBISHI MATERIALS CORP
View PDF1 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In the above-mentioned existing laser processing technology, for example, when grooving or cutting processing is performed on semiconductor materials such as silicon substrates or ceramic materials such as alumina substrates, in order to improve processing capabilities, measures are taken to increase the average output or peak power. However, compared with the processing of organic materials such as resin materials or metals, it is difficult to improve the processing capacity

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laser processing method and laser processing apparatus
  • Laser processing method and laser processing apparatus
  • Laser processing method and laser processing apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0057] In the laser processing of the present invention, the processing ability in the case of actually performing grooving processing on an alumina substrate was studied.

[0058] In this embodiment, as shown in Table 1, the groove depth was changed by changing the scanning speed to 20, 50, 100 mm / s for processing.

[0059] As processing conditions, Example (1) in which pulse width, frequency, and average output were set to 40nsec, 30kHz, and 1W, and Example (2) in which pulse width, frequency, and average output were set to 55nsec, 40kHz, and 1W were examined. Furthermore, comparative examples in which the pulse width, frequency, and average output were respectively set to 10nsec, 30kHz, and 3W were studied as conventional processing conditions. Table 1 and Fig. 2 show the results of this study. In addition, the number of traces (trace) is set to 2 times.

[0060] Table 1

[0061] comparative example

Example (1)

Example (2)

scanning speed

(m...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Wavelengthaaaaaaaaaa
Login to View More

Abstract

The invention improves the processing performance in a grooving process and a cutting process of a semiconductor material and a ceramic material by using laser beams. A laser processing method and a laser processing apparatus are provided for performing a grooving process or a cutting process by pulse-irradiating an inorganic object to be processed with ultraviolet laser beams. The deeper the processing depth of the grooving process or the cutting process becomes or the higher the scanning speed of the ultraviolet laser beams becomes, the longer the pulse width of the ultraviolet laser beams is set. Thus, compared with the case wherein the average output power is increased, the processing performance can be remarkably improved.

Description

technical field [0001] The present invention relates to a laser processing method and a laser processing device suitable for performing grooving processing, cutting processing, and the like on semiconductor materials, ceramic materials, and the like. Background technique [0002] In recent years, laser processing techniques such as ultraviolet lasers capable of high-precision processing have been adopted for grooving (scribing) or cutting of resin substrates, metal plates, ceramic plates, semiconductor wafers, and the like. [0003] In this laser processing technology, it is disclosed that in order to improve the processing ability of grooving processing, etc., how many pulses of laser beams are irradiated at the same place has been very important in the past, and the average output of ultraviolet laser beams, injection It is very effective in terms of fluence and peak power. [0004] For example, Patent Document 1 proposes a technique of irradiating a laser with a high pea...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B23K26/40B23K101/40B28D5/00B23K26/402
Inventor 加藤浩和日向野哲
Owner MITSUBISHI MATERIALS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com