Lead-free welding flux alloy

Abstract

Lead-free solder alloy. The invention involves an alloy, particularly a lead-free solder alloy. The components weight percentages of the solder alloy are: Silver 0.1%~4.0%, copper 0.1% ~ 2%, Sb 0.002% ~ 0.2% and the rest is tin. The formula of said solder alloy in the invention is reasonable, has characteristics of unleaded, low prices, excellent weldability, it can prevent lead damage the human body when welding; it can replace the solder containing lead and can the prevent the welding silver plate eroded by silver; it is suitable to wave soldering, dip-soldering and reflow soldering,etc.

Description

technical field [0001] The invention relates to an alloy, especially a lead-free solder alloy. Background technique [0002] In the development process of solder, tin-lead alloy has always been the best quality and cheap soldering material, both in terms of soldering quality and reliability after soldering can meet the requirements of use; however, with the strengthening of human environmental protection awareness, "lead" Human beings have paid more and more attention to the harm of lead-containing compounds and their compounds to the human body and the pollution to the environment. Lead-containing compounds have been considered to be one of the most harmful chemicals to humans and the environment. The demand for new environmentally friendly materials that can replace lead-containing solder is increasing day by day in electronic product manufacturing and other related industries. Therefore, the development of lead-free solders to replace lead-tin solders has received more a...

AI Technical Summary

Problems solved by technology

However, the SnCu solder that does not contain Ag, in addition to its high melting point, also has disadvantages such as poor solderability and silver corrosion on the soldering of silver-plated parts.