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Preparation method of nanometer copper-silver bimetallic composite powder

A bi-metal and nano-copper technology is applied in the field of preparation of nano-copper-silver bi-metal composite powder, which can solve the problems of inability to form alloys, inability to see copper characteristic diffraction peaks, etc., so as to prevent waste and loss, improve the utilization rate of raw materials, Avoid the effect of uneven product texture

Inactive Publication Date: 2007-08-01
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Because copper and silver have different nucleation rates, they are often reduced separately under the action of a reducing agent and cannot form an alloy. On the XRD spectrum of the copper-silver bimetallic product (see the accompanying drawing of the patent specification), you can only see The characteristic diffraction peaks of silver can not be seen but the characteristic diffraction peaks of copper

Method used

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  • Preparation method of nanometer copper-silver bimetallic composite powder
  • Preparation method of nanometer copper-silver bimetallic composite powder
  • Preparation method of nanometer copper-silver bimetallic composite powder

Examples

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Embodiment 1

[0027] Weigh 0.24g solid Cu(NO 3 ) 2 ·3H 2 O, dissolved in 100ml of water to make an aqueous solution with a concentration of 0.01M. Then add a certain amount of ammonia water, the solution starts to become cloudy, stop adding ammonia water after the solution becomes clear again. Weigh 8.4g Cu(NO 3 ) 2 ·3H 2 Dissolve O in 100ml of water to make an aqueous solution with a concentration of 0.35M, and weigh 1.19g of AgNO at the same time 3 Dissolve in 50ml of water to make an aqueous solution with a concentration of 0.14M, then mix the two solutions to make 150ml of Cu(NO 3 ) 2 +AgNO 3 The mixed solution has a Cu / Ag molar ratio of 5:1. Measure 10ml of hydrazine hydrate and mix with 90ml of water, the volume concentration is 10%. Mix the prepared cuproammonia solution and hydrazine hydrate solution under strong stirring, keep warm in a water bath at 50°C, the solution turns reddish brown rapidly, keep warm, and stir for 10 minutes. The prepared Cu(NO 3 ) 2 +AgNO 3 Th...

Embodiment 2

[0029] Weigh 0.24g solid Cu(NO 3 ) 2 ·3H 2 O, dissolved in 100ml of water to make an aqueous solution with a concentration of 0.01M. Then add a certain amount of ammonia water, the solution starts to become cloudy, stop adding ammonia water after the solution becomes clear again. Weigh 4.8g Cu(NO 3 ) 2 ·3H 2 Dissolve O in 100ml of water to make an aqueous solution with a concentration of 0.2M, and weigh 1.7g of AgNO at the same time 3 Dissolve in 50ml of water to make an aqueous solution with a concentration of 0.2M, and then mix the two solutions to make 150ml of Cu(NO 3 ) 2 +AgNO 3 The mixed solution has a Cu / Ag molar ratio of 2:1. Measure 10ml of hydrazine hydrate and mix with 90ml of water, the volume concentration is 10%. Other steps are with embodiment 1. The prepared copper-silver bimetallic composite powder was analyzed by XRD (see Figure 2(b)), TEM (see Figure 4) and TG (see Figure 6(c)).

Embodiment 3

[0031] Weigh 0.24g solid Cu(NO 3 ) 2 ·3H 2 O, dissolved in 100ml of water to make an aqueous solution with a concentration of 0.01M. Then add a certain amount of ammonia water to start the solution to become turbid, and stop adding ammonia water after the solution becomes clear again. Weigh 0.96g Cu(NO 3 ) 2 ·3H 2 O was dissolved in 25ml of water to prepare an aqueous solution with a concentration of 0.16M, and at the same time weighed 4.25g of AgNO 3 Dissolve in 75ml of water to make an aqueous solution with a concentration of 0.33M, then mix the two solutions to make 100ml of Cu(NO 3 ) 2 +AgNO 3The mixed solution has a Cu / Ag molar ratio of 1:5. Measure 10ml of hydrazine hydrate and mix with 90ml of water, the volume concentration is 10%. Other steps are with embodiment 1. The prepared copper-silver bimetal composite powder was analyzed by XRD (see Figure 2(c)), TEM (see Figure 5) and TG (see Figure 6(d)).

[0032] As can be seen from Figure 2, the XRD spectrum of...

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Abstract

The invention provides a nano-copper-silver double metal powder preparation method--crystal nucleon growth method. The method prepares nano-copper seed crystal using chemical reduction copper ions, makes the copper and silver generate on nano-copper seed crystal to preparing copper silver double metal powder. The process is: first dissolving a small amount of copper ion salts cupric nitrate into water, preparing cup ammonium solution with ammonia complication, then deacidizing it into sol containing nano-copper seed crystal in the water solution of hydrazine hydrate, then making the silver nitrate and cupric nitrate grow on the nano-copper seed crystal in the deacidized process to forming copper-silver double metal particles, preparing final product after washing and drying. The method solves the shortcomings of big waste of copper and silver and non-uniform product quality in prior art. The particle size of prepared nano-copper-silver double metal powder is less than 100 nm, and it has good dispersion and good oxidation resistance property.

Description

technical field [0001] The invention belongs to the technical field of metal powder preparation in metal materials, in particular to a preparation method of nanometer copper-silver bimetal composite powder. Background technique [0002] With the development of science and technology, the application of nano-scale copper-silver bimetallic powder is more and more extensive. For example, in the field of conductive fillers, because nano-copper powder is easily oxidized at room temperature, it loses its original physical and chemical properties, resulting in a decrease in electrical conductivity, while copper-silver bimetallic powder not only has the properties of copper powder and silver powder, but also avoids It overcomes the disadvantage of weak oxidation resistance of copper powder, and at the same time can reduce the cost of silver powder without affecting its electrical conductivity, so it has received great attention. In the field of conductive adhesives, nano-copper-sil...

Claims

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Application Information

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IPC IPC(8): B22F1/00B22F9/24
Inventor 陈建峰刘潇潇乐园许恒哲
Owner BEIJING UNIV OF CHEM TECH
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