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Process for synthesizing heat-radiating ointment

A technology of heat dissipation paste and mixture, which is applied in the field of preparation of thermal interface materials, can solve the problems of low efficiency, inability to uniformly disperse thermally conductive powder, and long time required.

Inactive Publication Date: 2009-12-23
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the filling powder content in the heat dissipation paste increases to a certain extent, it is difficult to further improve the thermal conductivity of the heat dissipation paste with the increase of the filling powder content; this is because when the filling powder content is high, the gap between the filling powder particles It is more and more easy to agglomerate and form aggregates. It takes a long time and low efficiency to mix with the existing technology, and it is even caused by the inability to evenly disperse the aggregates of thermal conductive powder.

Method used

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  • Process for synthesizing heat-radiating ointment
  • Process for synthesizing heat-radiating ointment
  • Process for synthesizing heat-radiating ointment

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Embodiment Construction

[0011] The method for synthesizing heat dissipation paste will be further described in detail with reference to the accompanying drawings and examples.

[0012] The method for synthesizing thermal paste comprises the steps:

[0013] Step 1, providing filling powder and thermal paste base material. The filler powder is a thermally conductive material, including one of silver, gold, copper, nickel, aluminum, aluminum oxide, zinc oxide, boron nitride, bauxite, aluminum nitride, graphite, carbon black or a combination thereof.

[0014] The mass ratio of the filler powder to the base material is 1:1-9:1.

[0015] The base material can be liquid silicone oil, polyethylene glycol, polyester or a combination thereof at normal temperature; or polyvinyl acetate, polyethylene, siloxane, polyvinyl chloride, amino ring Oxygen resin, polyacrylate, polypropylene, epoxy resin, polyoxymethylene, polyacetal, polyvinyl alcohol or a combination thereof.

[0016] Step 2, adding the filling powd...

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Abstract

The invention provides a method for synthesizing heat dissipation paste, which comprises the following steps: providing filling powder and heat dissipation paste base material; adding the filling powder and base material into a mixing container to form a mixture, and keeping the base material in a molten state or liquid; and the mixture is pressurized and stirred to make it evenly mixed. The method for synthesizing heat dissipation paste has the advantage of allowing the heat dissipation paste to be mixed quickly and efficiently.

Description

【Technical field】 [0001] The invention relates to a method for preparing a thermal interface material, in particular to a method for synthesizing thermal paste. 【Background technique】 [0002] With the densification and miniaturization of integrated circuits, electronic components become smaller and run at higher speeds, and at the same time, the requirements for heat dissipation are also increasing. Thermal grease is widely used in electronic components because of its good thermal conductivity. [0003] Thermal paste is composed of a base material mixed with thermally conductive filling powder, and the thermally conductive powder must be evenly dispersed in the base material in order for the thermal paste to have better thermal conductivity. In the prior art, in order to disperse the base material and the filling powder evenly, the thermal paste is generally mixed and synthesized by mixers such as a planetary mixer, a twin-shaft mixer, and a triangular roller. When the pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K5/08
CPCH01L2924/0002H01L23/373C09K5/14H01L23/42H01L2924/00
Inventor 萧博元
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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