Process for synthesizing heat-radiating ointment
A technology of heat dissipation paste and mixture, which is applied in the field of preparation of thermal interface materials, can solve the problems of low efficiency, inability to uniformly disperse thermally conductive powder, and long time required.
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[0011] The method for synthesizing heat dissipation paste will be further described in detail with reference to the accompanying drawings and examples.
[0012] The method for synthesizing thermal paste comprises the steps:
[0013] Step 1, providing filling powder and thermal paste base material. The filler powder is a thermally conductive material, including one of silver, gold, copper, nickel, aluminum, aluminum oxide, zinc oxide, boron nitride, bauxite, aluminum nitride, graphite, carbon black or a combination thereof.
[0014] The mass ratio of the filler powder to the base material is 1:1-9:1.
[0015] The base material can be liquid silicone oil, polyethylene glycol, polyester or a combination thereof at normal temperature; or polyvinyl acetate, polyethylene, siloxane, polyvinyl chloride, amino ring Oxygen resin, polyacrylate, polypropylene, epoxy resin, polyoxymethylene, polyacetal, polyvinyl alcohol or a combination thereof.
[0016] Step 2, adding the filling powd...
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