Planar display and chip joint pad

Abstract

A plane display and its chip bonding pads. The plane display includes a display panel, a flexible circuit board, a first source driver chip, a second source driver chip and a control circuit board. There are a plurality of first wires and second wires in the peripheral circuit area of ​​the display panel, the first wires and the second wires respectively extend from the bottom of the flexible circuit board to the two opposite sides of the display panel, and are connected with the flexible circuit board electrical connection. The first source driver chip is electrically connected to the flexible circuit board through a part of the first wire. The second source driver chip is electrically connected to the flexible circuit board through the second wire. The chip bonding pad is located under the first source driver chip or the second source driver chip, the first dielectric layer has a plurality of first contact openings, and the second dielectric layer has a plurality of alternately arranged second contact openings and the third contact opening, and the second contact opening corresponds to the first contact opening.

Description

technical field [0001] The invention relates to a flat display and a chip bonding pad, and in particular to a flat display with signal transmission impedances matched to each other and a chip bonding pad with low signal transmission impedance. Background technique [0002] With the development of the information industry, the requirements for the volume occupied by various displays in the market are getting higher and higher, and therefore various displays are constantly developing towards thinning. For example, flat panel displays such as liquid crystal displays and organic light emitting displays have replaced traditional picture tube displays and become mainstream products of displays. [0003] Figure 1A It is a schematic diagram of a traditional flat panel display. Please refer to Figure 1A , the flat panel display 100 includes a display panel 110 , a plurality of flexible circuit boards 120 , a plurality of driving chips 130 and a control circuit board 140 . The dis...

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide a flat-panel display, which can solve the problem that the traditional flat-panel display requires a large material cost for the flexible circuit board and the control circuit board

[0010] Another object of the present invention is to provide a chip bonding pad, which can solve the problem of high transmission impedance in traditional chip bonding pads

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