Substrate processing apparatus and method

Abstract

A substrate processing apparatus and a substrate processing method capable of effectively preventing re-adhesion of the processing liquid to the surface of the substrate in the substrate processing apparatus for performing predetermined processing on the substrate while supplying the processing liquid to the substrate while rotating the substrate. In the vicinity of the peripheral portion of the rotary base (5), a plurality of supporting portions (7) are protruded upward from the rotary base (5) and support the substrate (W) while contacting the peripheral portion of the lower surface of the substrate (W). The substrate (W) is horizontally supported in a state separated by a predetermined distance from a rotating base (5) facing the lower surface of the substrate (W) by a plurality of support parts (7). Inert gas is ejected from a plurality of gas ejection ports (9b) provided on the facing surface (9a) of the environment blocking plate (9) into a space formed between the upper surface of the substrate (W) and the facing surface (9a). Thereby, the substrate is pressed against the support portion (7) by the inert gas supplied to the upper surface side of the substrate and held by the rotary base (5).

Description

technical field [0001] The present invention relates to the process of supplying a treatment liquid to various substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, and substrates for optical disks, and performing cleaning and other treatments on the substrates. Substrate processing apparatus and substrate processing method. Background technique [0002] Conventionally, as such a substrate processing apparatus, there is a substrate processing apparatus in which a substrate such as a semiconductor wafer is supported on a disk-shaped rotary base member rotatably supported around a vertical axis, and the substrate is rotated while rotating the substrate. A processing liquid such as a chemical liquid is supplied to the upper and lower surfaces of the substrate to process the substrate (see Patent Document 1). In the substrate processing apparatus described in Patent Document ...

AI Technical Summary

Problems solved by technology

In addition, in order to process the holding portion where the substrate is held by the chuck pins, sometimes the chuck pins of the substrate are opened and closed (unhold the substrate) during the processing, but at this time, the processing liquid that moves outward in the radial direction of the substrate due to the chuck pins is particularly easy to spring back

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