Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat treatment method and heat treatment device

A heat treatment method and heat treatment device technology, which are applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as difficulty in temperature control of cylindrical heaters

Inactive Publication Date: 2009-04-08
TOKYO ELECTRON LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the above-mentioned vertical heat treatment apparatus, in order to detect the temperature at a position separated from the semiconductor wafer, an error inevitably occurs between the temperature detected by the temperature detector and the temperature of the semiconductor wafer. Cartridge heater temperature control is difficult

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat treatment method and heat treatment device
  • Heat treatment method and heat treatment device
  • Heat treatment method and heat treatment device

Examples

Experimental program
Comparison scheme
Effect test

experiment example

[0101] Below, explain figure 1 An embodiment of a vertical heat treatment apparatus of the structure shown.

[0102] 25 semiconductor wafers with a wafer diameter of 200mm are placed into multiple sections in the up and down direction with a pitch of 15.6mm, and the wafer tray (17) containing the simulated dummy wafer on the top and bottom is accommodated in the processing container (11 )Inside. Next, the cylindrical heater (30) and the planar heater (32) were operated with the set reference calorific value to bring all the semiconductor wafers to 800°C (target heating temperature). From the start of heating, after 2 hours, utilize the temperature detector (40) for control and the temperature detector (50) for correction to carry out temperature detection, and the temperature of the controlled object detected by the temperature detector (40) for control is 800 ° C, by The control target temperature detected by the calibration temperature detector (50) is 803°C.

[0103] In ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A heat treatment method comprising a step of accommodating a holder with a plurality of works placed in multiple stage in the vertical direction in a treatment vessel and a step of performing a predetermined heat treatment by performing heating by a heating means. A specific target amount of heat generated by the heating means for performing the heat treatment of the works is determined in advance. A heat treatment device has the heat treatment vessel and a control temperature and a correction temperature sensor which are provided in the heat treatment vessel. The correction temperature sensor comprises a protective pipe body part extending in the vertical direction and a plurality of branch pipe parts extending in the horizontal direction from the protective pipe body part. A thermocouple is disposed on each branch pipe part, and the branch pipe parts are inserted between the works in height positions different from each other.

Description

technical field [0001] The invention relates to a heat treatment method and a heat treatment device. Background technique [0002] In the manufacturing process of semiconductor devices, various heat treatment apparatuses are used to perform treatments such as oxidation, diffusion, and film formation on semiconductor wafers as objects to be processed. For example, there is known a batch-type vertical heat treatment apparatus capable of heat-treating a plurality of objects to be processed at one time. [0003] In such a vertical heat treatment apparatus, a processing object holding jig for placing a plurality of objects to be processed at predetermined intervals in a height direction is accommodated in a processing container. In addition, predetermined heat treatment is performed on the object to be processed by heating with a calorific value set based on temperature data detected by a temperature detector provided in the processing container by a cylindrical heater provided ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/205H01L21/22H01L21/00
CPCH01L21/67109
Inventor 牧谷敏幸斋藤孝规滝泽刚爱库曼香留树
Owner TOKYO ELECTRON LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com