Heat sink for ball single array packaged chip and its application

An array packaging and heat dissipation device technology, which is applied to the combination of ball single array package chips and printed circuit boards, and the field of heat dissipation devices, can solve the problems of increased PCB board cost, increased number of via holes, increased chip manufacturing costs, etc., to achieve excellent heat dissipation High performance, good cooling effect, low cost effect

Active Publication Date: 2008-07-09
NEW H3C TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] First of all, increasing the physical size of the chip will lead to a rapid increase in chip manufacturing costs; increasing the number of fans, or adding a heat sink to the BGA chip, will increase the cost of the entire electronic device; and cooling the BGA chip through the internal layers of the PCB board Method, because the ground layer is located inside the PCB board, there is no good air convection condition, so the heat dissipation effect is limited. If the heat on the ground layer inside the PCB board is transferred to the surface layer of the PCB board, it is necessary to connect the ground layer and the surface layer through via holes. connect them
However, a large increase in the number of via holes will affect the signal design of the entire PCB board, especially the increase in the surface of the PCB board, resulting in an increase in the cost of the PCB board

Method used

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  • Heat sink for ball single array packaged chip and its application
  • Heat sink for ball single array packaged chip and its application

Examples

Experimental program
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Effect test

no. 1 example

[0041] First embodiment: figure 1 A part of the chip pin arrangement diagram of a BGA chip is given in . This BGA chip 11 has four rows of pins. Among them, pins 1, 2, and 3 are power supply pins whose attribute is power; pins 4, 5, and 6 are ground pins whose attribute is ground; other black pins are signal pins of the BGA chip. Because the copper wires connecting the signal pins are too much and other processing will generate noise and affect the signal transmission quality, so the signal pins for transmitting signals cannot be used for heat dissipation, and the power pins and ground pins only have specific electrical properties, so A heat sink can be added around it to dissipate the heat inside the chip. On the PCB 7 , the signal pins provide electrical signals to the outside through dotted lines. The BGA chip 11 has a definite package size on the PCB 7, and all pins are within the package size.

[0042] figure 1 Among them, the pins 1, 2, and 3 whose attribute is powe...

no. 2 example

[0045] The second embodiment: with figure 2 shown as an example. The BGA chip 11 has four rows of pins. Among them, pins 1, 2, and 3 are power supply pins whose attribute is power supply; pins 4, 5, and 6 are ground pins whose attribute is ground; other black pins are signal pins of BGA chip; marked in the figure 15 is a via. On the PCB 7 , the signal pins provide electrical signals to the outside through dotted lines. The BGA chip 11 has a definite package size on the PCB 7, and all pins are within the package size. This embodiment describes the process of connecting the large-area copper sheet on the surface layer of the PCB to the power layer of the PCB through via holes to dissipate heat. Since the process of connecting the large-area copper sheet whose electrical property is the ground on the surface layer of the PCB to the ground layer through the via hole can be derived accordingly, it will not be repeated here.

[0046] figure 1 Among them, the pins 1, 2, and 3 ...

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Abstract

This invention discloses a heat sink of ball single-array packaged chip including at least one metal radiator with electric attribute as the power supply or as the earth at the CB surface layer, one metal radiator covers the supply pin or the earth pin of the packaged chip. A combination device of the ball single array package chip and the CB is also disclosed including: a ball single array package chip at the surface of the CB and having at least a set of pins with the same electric attribute, at least a metal radiator with one part exposed at the CB surface, the other part extends between the chip and the CB and covers a set of pins with the same electric attribute.

Description

technical field [0001] The invention relates to a heat dissipation technology for a high-power chip, in particular to a heat dissipation device for a BGA (Ball Grid Array Package) chip and a combination of a ball grid array package chip and a printed circuit board. Background technique [0002] With the continuous improvement of chip integration, the number of I / O (Input / Output, input / output) pins has increased sharply, power consumption has also increased, and the requirements for integrated circuit packaging have become more stringent. More and more chips adopt a BGA (Ball Grid Array Package) structure to realize complex functions. Chips designed in the form of BGA packages have a large number of pins and can perform complex functions. In order to realize these complex functions, the chip needs to consume more current when working, so a lot of heat will be generated inside. In order to ensure the normal operation of the chip, the chip needs to dissipate heat in time, oth...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/34H05K7/20
CPCH01L2924/0002H01L2924/00
Inventor 沈明董树国吕晗
Owner NEW H3C TECH CO LTD
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