Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for preparing microlite silicon

A technology of microcrystalline silicon and amorphous silicon thin film, applied in the field of silicon materials, transforming amorphous silicon into microcrystalline silicon, can solve the problems of reducing manufacturing costs, low mobility, low crystallinity, etc.

Inactive Publication Date: 2007-12-26
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem in the preparation of microcrystalline silicon μc-Si material by this method is that its growth rate is low (<1A) which is not conducive to reducing manufacturing costs
[0007] The above-mentioned preparation of microcrystalline silicon thin films by direct deposition method has the following problems to varying degrees: the growth rate is low, which is not conducive to reducing the manufacturing cost; the crystallinity is low, about 50%; the mobility is low, and the photoelectric conversion efficiency is low

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for preparing microlite silicon
  • Method for preparing microlite silicon

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The present invention will be further described below in combination with specific embodiments.

[0020] A 50nm-thick hydrogenated amorphous silicon film (a-Si:H) was deposited on glass by plasma-enhanced chemical vapor deposition (PECVD), the substrate temperature was 220°C, and the RF power density was 0.03W / cm 2 , the gas flow rate is 15 sccm, and the reaction chamber pressure is 80Pa.

[0021] The above-mentioned hydrogenated amorphous silicon film sample 6 is placed upward on the heating plate 2 at the bottom of the vacuum annealing furnace 1 shown in Figure 1, and after the window 5 is covered, the annealing furnace is evacuated; when the vacuum reaches 2Pa, the heating plate 2 is turned on. The power supply is heated, and the ultraviolet light source 4 is turned on at the same time; when the sample 6 reaches the set temperature of 400°C, the ultraviolet illuminance of the ultraviolet light source 4 is stabilized at 1mW / cm 2 , remove the cover on the window 5, le...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A process for preparing microcrystal silicon includes preparing non-crystal silicon film on glass substrate, putting it in vacuum annealing furnace, and vacuum annealing while radiating it by ultraviolet ray for phase change to obtain microcrystal silicon film. Its advantages are high speed and high crystallinity.

Description

technical field [0001] The invention belongs to the technical field of semiconductor materials and relates to a silicon material, in particular to a method for converting amorphous silicon into microcrystalline silicon. Background technique [0002] The mobility and photoelectric conversion efficiency of microcrystalline silicon are higher than those of amorphous silicon, and compared with polycrystalline silicon, the preparation process is simple and the cost is low, so it is widely used in the preparation of thin film transistors and solar cells. [0003] At present, the method of preparing microcrystalline silicon is mainly direct deposition method, including ultra-high frequency plasma enhanced chemical vapor deposition (VHF PECVD), hot wire chemical vapor deposition (HW CVD) and electron cyclotron resonance chemical vapor deposition (ECR CVD). . [0004] The very high frequency plasma chemical vapor deposition (VHF PECVD) method is based on H 2 Diluted SiH 4 The gas ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C30B29/06C30B28/02H01L21/34
Inventor 黄金英付国柱荆海凌志华
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products