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Semiconductor device having a transparent window for passing radiation

a technology of semiconductor devices and radiation, applied in the direction of radiation controlled devices, semiconductor devices, electrical equipment, etc., can solve the problems of subjecting the die and wire bonds of the package to the harsh molding environment, and affecting the cost of the final product, so as to achieve convenient and reliable

Active Publication Date: 2017-04-11
MELEXIS TECH NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This approach reduces tool costs, allows for more complex shapes and easier cleaning of tools, and integrates the window with the cap layer, reducing the risk of reflections and obstructions, while enabling the creation of various window geometries and shapes.

Problems solved by technology

The choice of the packaging material for the electrical components for these markets can have a substantial impact on the cost of the final product.
However, this process does subject the die and wire bonds of the package to the harsh molding environment.

Method used

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  • Semiconductor device having a transparent window for passing radiation
  • Semiconductor device having a transparent window for passing radiation
  • Semiconductor device having a transparent window for passing radiation

Examples

Experimental program
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Embodiment Construction

[0052]The present invention will be described with respect to particular embodiments and with reference to certain drawings but the invention is not limited thereto but only by the claims. The drawings described are only schematic and are non-limiting. In the drawings, the size of some of the elements may be exaggerated and not drawn on scale for illustrative purposes. The dimensions and the relative dimensions do not correspond to actual reductions to practice of the invention.

[0053]The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a sequence, either temporally, spatially, in ranking or in any other manner. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of operation in other sequences than described or illustrated herein.

[0054]Moreover, the terms top,...

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Abstract

Method of encapsulating a semiconductor structure comprising providing a semiconductor structure comprising an opto-electric element located in a cavity formed between a substrate and a cap layer, the cap layer being made of a material transparent to light, and having a flat upper surface; forming at least one protrusion on the cap layer; bringing the at least one protrusion of the cap layer in contact with a tool having a flat surface region, and applying a opaque material to the semiconductor structure where it is not in contact with the tool; and removing the tool thereby providing an encapsulated optical semiconductor device having a transparent window integrally formed with the cap layer.

Description

FIELD OF THE INVENTION[0001]The present invention relates to the field of methods of manufacturing semiconductor devices and to semiconductor devices thus obtained, more in particular to methods of packaging semiconductor devices such as e.g. IR-sensors, in a package having a transparent window for passing radiation, e.g. IR-light, and to devices obtained by such methods.BACKGROUND OF THE INVENTION[0002]Several packages and packaging techniques for encapsulating integrated circuits are known in the art, such as glass, metal, ceramic and plastic packages.[0003]As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency of the semiconductor devices as a whole. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these trends. These markets see high volume manufacturing with millions of units on a yearly basis. The choice of the packaging material for the elec...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01L29/24H01L27/146H01L31/0216H01L31/0203
CPCH01L31/0203H01L27/14618H01L27/14623H01L31/02164H01L27/14649H01L27/14685
Inventor VAN BUGGENHOUT, CARLCHEN, JIAN
Owner MELEXIS TECH NV
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