Light emitting diode load board and manufacturing process thereof

Abstract

A light emitting diode load board includes a substrate, a first dielectric layer, a second dielectric layer and a first conductive pad and a second conductive pad. The second dielectric layer includes a first structure part, a second structure part and a third structure part. The first dielectric layer is disposed on the substrate. The first structure part is disposed on the first dielectric layer and has a first sidewall. The second structure part is disposed on the first structure part and has a second sidewall. The third structure part is disposed on the second structure part and has N sidewalls. The second sidewall is more prominent than the first sidewall. The first sidewall, the second sidewall and the N sidewalls define the first etched part, and the part of the first dielectric layer is exposed from the first etched part. The first conductive pad is disposed in the first etched part. The second conductive is disposed on the second dielectric layer, covers part of the second dielectric and exposes the open of the first etched part.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 62 / 148,722 filed in the United States on Apr. 16, 2015, the entire contents of which are hereby incorporated by reference.BACKGROUND[0002]Technical Field[0003]The disclosure relates to a light emitting diode (LED) load board and a manufacturing method thereof, more particularly to a LED load board with an alignment structure and a manufacturing method thereof.[0004]Related Art[0005]Generally, when LEDs are powered to emit light, the supplied power is partly used to emit light and partly converted into thermal energy. In practice, the luminous efficiency of a LED rapidly drops under the influence of a high temperature environment, so the LED wastes more power and also produces more heat, resulting in the increase of temperature. The LED then falls into a vicious spiral. Therefore, it would be better to load LEDs on a load board with a bett...

AI Technical Summary

Benefits of technology

The patent describes a new LED load board structure that prevents electrical shorts and improves alignment with LEDs. The board has conductive pillars that help connect with LEDs, and a layer made of polysilicon improves thermal conductivity. This results in more efficient connection and better heat transfer. The new structure and method of manufacturing the LED load board enhance the process of aligning and connecting LEDs.

Problems solved by technology

In practice, the luminous efficiency of a LED rapidly drops under the influence of a high temperature environment, so the LED wastes more power and also produces more heat, resulting in the increase of temperature.

This will bring in a difficulty in the assembling process and also decrease the yield rate of the manufacturing of load boards.

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