Device for compensating for a test temperature deviation in a semiconductor device handler

Abstract

A semiconductor device handler is provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing is compensated for, allowing a test of the semiconductor device to be carried out at an exact temperature, or within an exact temperature range. The semiconductor device handler includes at least one enclosed chamber, a heating / cooling apparatus configured to bring an inside of the at least one chamber to a low or high temperature state, a pushing unit provided within the at least one chamber and configured to push a plurality of semiconductor devices mounted on a test tray into test sockets of a test board located within the at least one chamber for testing, a cooling fluid supplying apparatus configured to supply cooling fluid, a nozzle assembly configured to spray cooling fluid received from the cooling fluid supplying apparatus onto the semiconductor devices fitted to the test sockets, and a control unit configured to control spraying of cooling fluid onto the semiconductor devices during testing to compensate for temperature changes of the semiconductor devices that occur during testing.

Description

BACKGROUND OF THE INVENTION1. Field of the InventionThe invention relates to a handler for use in testing semiconductor devices, and more particularly, to a device for compensating for a test temperature deviation in a semiconductor device handler.2. Background of the Related ArtIn general, memory, or non-memory semiconductor devices, or modules each having memory, and / or non-memory semiconductor devices arranged on a substrate to form a circuit, are subjected to various tests after fabrication before shipment. The semiconductor device handler (hereafter referred to as “handler”) is an apparatus for automatic transportation of the semiconductor devices or the modules during testing. The handler carries out a process in which, when a loading stacker receives trays having the semiconductor devices or modules held therein, a picker robot transports the semiconductor devices or modules to be tested to a test site, fits them into test sockets, carries out required tests, transports the t...

AI Technical Summary

Benefits of technology

An object of the invention is to solve at least the above problems and / or disadvantages and to provide at least the advantages described hereinafter.

Accordingly, the invention is directed to a device for compensating for a test temperature deviation in a handler that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.

Problems solved by technology

This added heat impedes conducting a test at an exact preset temperature.

This is a problem that must be solved for both test and actual application environments as the semiconductor devices become smaller and packing density increases.

For example, in a high temperature test, if a user sets a temperature of an inside of the chamber to 80° C. for the test, if there is no heat generated by the semiconductor device itself, the test can be carried out at the set temperature of 80° C. However, if heat is generated by the semiconductor device during the test, causing a test temperature deviation of approx.

This results in a drop in yield and reliability as the test at the desired exact temperature or within the desired temperature range failed.

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