Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

LED module and LED lamp including the same

Inactive Publication Date: 2019-09-26
SAMSUNG ELECTRONICS CO LTD
View PDF2 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text aims to provide a filament-type LED module that can emit light from both the front and rear surfaces and is easy to process. The LED lamp that uses this module also aims to provide high illumination levels.

Problems solved by technology

Such incandescent lamps or fluorescent lamps have a relatively short lifespan and therefore frequently have to be replaced.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED module and LED lamp including the same
  • LED module and LED lamp including the same
  • LED module and LED lamp including the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025]Hereinafter, example embodiments of the present inventive concepts will be described with reference to the accompanying drawings.

[0026]FIG. 1 is a side cross-sectional view illustrating a light emitting diode (LED) module according to some embodiments of the present inventive concepts, and FIG. 2 is a top plan view of an LED module illustrated in FIG. 1.

[0027]Referring to FIGS. 1 and 2, an LED module 200 according to some embodiments may include a flexible substrate 110 having a first surface 110A and a second surface 110B disposed opposing each other, a plurality of LED chips 150 mounted on the first surface 110A of the flexible substrate 110, first and second connection terminals 270a and 270b for applying a driving voltage, connected to the plurality of LED chips 150, and a wavelength converter 190 covering the plurality of LED chips 150, and surrounding the flexible substrate 110.

[0028]The flexible substrate 110 may include a circuit pattern 115 disposed on the first surfa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An LED module includes a flexible substrate having a first surface on which a circuit pattern is disposed and a second surface opposing the first surface, and having a light transmittance of 80% or more; a plurality of LED chips mounted on the first surface of the flexible substrate, and electrically connected to the circuit pattern; first and second connection terminals disposed at both ends of the flexible substrate, and connected to the circuit pattern; and a wavelength converter covering the plurality of LED chips, and surrounding the flexible substrate.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims benefit of priority to Korean Patent Application No. 10-2018-0033410 filed on Mar. 22, 2018 in the Korean Intellectual Property Office, the disclosure of which may be incorporated herein by reference in its entirety.BACKGROUND1. Field[0002]The present inventive concepts relate to a light emitting diode (LED) module and an LED lamp including the same.2. Description of Related Art[0003]In general, incandescent lamps or fluorescent lamps are commonly used as indoor or outdoor lighting lamps. Such incandescent lamps or fluorescent lamps have a relatively short lifespan and therefore frequently have to be replaced.[0004]In order to solve such a problem, an illumination device using an LED having higher photoelectric conversion efficiency and / or an improved lifespan has come to prominence.[0005]In addition, an LED device may offer various advantages, such as greater resistance to impacts, lower power consumption, a semi-p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): F21K9/232F21V23/06H01L25/075H01L23/538H01L33/50H01L33/56H01L33/62
CPCH01L25/0753F21V23/06H01L23/5387H01L33/62F21K9/232F21Y2115/10H01L33/56H01L33/504F21V23/00F21V23/005F21K9/20F21K9/278F21V9/32H01L25/167H01L33/48H01L33/505H01L27/15H01L33/502
Inventor PARK, MI HYAEPAEK, HO SUNYOU, JAE SUNGYOON, CHUL SOOLIM, YOUNG MOOK
Owner SAMSUNG ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com